[Semiconductor Back-end Process] "Paper-based TPS Cleaning Sheet" Adopted for Semiconductor Encapsulation Mold Cleaning ~Developed through Industry-Academia-Government Collaboration, Utilization in Actual Manufacturing Lines Begins~

Tohoku Logistics Co., Ltd. (Headquarters: Yonezawa City, Yamagata Prefecture, President: Kenji Maeyama) is pleased to announce that its 'Paper-based TPS Cleaning Sheet,' developed through industry-academia-government collaboration and corporate alliances, has been officially adopted in the manufacturing processes of a major domestic semiconductor manufacturer, and its utilization for cleaning resin encapsulation molds in the semiconductor back-end process has commenced on actual production lines.

Background of Development Semiconductors used in smartphones, automobiles, and various electronic devices are manufactured through a 'molding process' where resin is poured into a mold to protect them from the external environment. In this process, cleaning to remove resin residue and impurities adhering to the mold surface is essential. Traditionally, metal frames and glass epoxy substrates have been used for this purpose. On the other hand, against the backdrop of soaring metal material prices in recent years and increasing demands for improved manufacturing process efficiency and reduced environmental impact, the need for new materials and methods to replace these has been growing.

Product Overview and Features This product is a sheet for cleaning semiconductor encapsulation molds, developed based on Tohoku Logistics Co., Ltd.'s paper processing technology. Despite being made of paper, it possesses the following characteristics required for semiconductor manufacturing processes. Particularly, regarding dust prevention, which is crucial in precision processes, the company has succeeded in suppressing dust generation through its proprietary technology (domestic patent acquired). ・Rigidity: Enables stable handling during the process

・Dust Prevention: Suppresses dust generation, reducing impact on precision processes

・Heat Resistance: Can be used under the conditions of the encapsulation process (high-temperature environment)

・Adhesion: Compatible with automated process conveyance

Effects of Implementation This product is currently in operation on actual manufacturing lines, and the following effects have been confirmed: ・Approximately 20-30% cost reduction compared to conventional methods

・Reduction in cleaning frequency from about 5 times to about 3 times

・Reduction in process load and improvement in work efficiency

・Reduced environmental impact due to decreased use of petroleum-derived materials

<img src="https://prcdn.freetls.fastly.net/release_image/179952/1/179952-1-f3ec4505a9520f976c67a466df1bf937-3840x2160.png?width=1950&height=1350&quality=85%2C65&amp