Sumitomo Bakelite to Present Next-Gen AI Semiconductor Materials at ECTC 2026

Sumitomo Bakelite will participate in ECTC 2026 in Orlando, Florida, presenting three research papers on advanced semiconductor packaging. Collaborating with Georgia Tech and Tohoku University, the company will showcase low-dielectric RDL materials for glass substrates, optical RDL interposer technology for Co-Packaged Optics (CPO), and high thermal conductivity encapsulants for automotive applications. These innovations target the high-density and reliability requirements of AI-driven chips, aiming to enhance the company's presence in the global next-generation electronics market.