TSMC held its second-quarter earnings call today (16th), announcing financial results that shattered records: consolidated revenue surpassed NT$1.27 trillion, and earnings per share (EPS) reached NT$27.25, both all-time highs for a single quarter.

In response to an analyst's question regarding competition from Intel's EMIB advanced packaging technology, Chairman Mark Liu stated clearly: "Advanced packaging capacity is extremely tight. We welcome more companies to invest in new advanced packaging technologies," allowing greater flexibility in customer planning.

Liu emphasized that TSMC's capital expenditure over the next three years will exceed that of the past three years. This includes a planned $100 billion investment in Arizona, supported by the U.S. government, to build multiple 2-nanometer process and advanced packaging fabs to meet strong demand from major U.S. customers. Additionally, TSMC will construct 13 advanced process packaging fabs in Taiwan, further increasing investment in its home base.

Intel's EMIB (Embedded Multi-die Interconnect Bridge) advanced packaging technology has recently gained significant market attention due to strong performance reports and major customer orders. In response, Liu noted that overall packaging capacity remains extremely constrained, and TSMC is working hard to close the gap between demand and supply for advanced packaging.

He stressed that advanced packaging is a crucial part of TSMC's business: "We welcome more companies to enter advanced packaging with new technologies," as it enhances market flexibility and supports TSMC's own growth.

Liu added that, according to media reports, other companies' advanced packaging technologies "appear promising." TSMC hopes for their success—not only to share some of TSMC's production load but also to give customers greater strategic flexibility. "TSMC's primary mission is to support our customers' success. We will do whatever it takes to help our customers succeed."

Additional exclusive insights from Feng Media: - Is 'Mr. Mediocre' a thing of the past? Report reveals Intel's two key technologies achieving 'yield explosion'—NVIDIA, Microsoft, and OpenAI all placing orders - TSMC is unhappy! ASML reveals plans to 'raise prices on lithography machines'—foreign media reports TSMC is dissatisfied and resisting - Is TSMC under pressure? Rise of advanced packaging technologies—Intel leads 'two major Taiwanese manufacturers' into Google's supply chain

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  • Source: PR Times
  • Category: 財報
  • Organizations: ASML / OpenAI / Google