PTI Partners with Broadcom to Advance FOPLP, Establishes Joint Venture in Singapore

PTI (6239-TW) announced today (16th) its plan to invest USD 400 million to jointly establish a manufacturing joint venture with Broadcom (AVGO-US) in Singapore, dedicated to panel-level advanced packaging (FOPLP). Industry observers believe that PTI, having developed FOPLP technology for over a decade and currently being the most technically mature player, can now directly secure AI chip packaging orders from major cloud service providers (CSPs) through this partnership with Broadcom.

PTI stated that the project requires approval from Taiwan's Ministry of Economic Affairs' Investment Commission and other relevant regulatory authorities. Upon receiving such approvals, PTI will proceed with subsequent transaction procedures and information disclosures in accordance with the approved terms and applicable laws.

The joint venture established by PTI and Broadcom in Singapore will focus on additive finer-geometry redistribution layer technology for advanced package substrates.

PTI will continue to invest in advanced packaging R&D and capacity expansion in Taiwan, maintaining core technologies and key intellectual property within Taiwan. PTI's participation in the Singapore joint venture aims to support international customer demand, and this collaboration will not affect PTI's cooperation with existing and future customers in the FOPLP field.