Molex Unveils Next-Generation Multi-Channel Liquid Cooling Busbar for AI Data Centers at Computex 2026

As AI workloads increase, integrating liquid cooling into the power backbone fills the thermal gap

With a unique 7-channel architecture, the HPR busbar uniformly extracts heat across the entire busbar, improving cooling efficiency by up to 20% compared to single-channel designs

Compatibility with ORV3 and HPR standards ensures future-proof investment protection

Lisle, Illinois – June 9, 2026 – Molex, a global leader in electronics and innovator in connection solutions, introduced its latest thermal management technology at Computex 2026 (Booth M1330, 4F, TAINEX 1). The centerpiece of the showcase was a new multi-channel liquid cooling busbar. As AI workloads grow, rack power requirements are approaching 1 megawatt (MW), pushing conventional air-cooling infrastructure to its physical limits. Molex bridges this 'AI thermal gap' by extending liquid cooling to the power distribution layer. Currently supporting up to 15,000 amperes, the design roadmap targets future compatibility with 25,000 amperes.

'Chip-direct cooling is now standard in compute,' said Kevin Alvord, VP and GM of Molex's Power Signal Business Unit (PSBU). 'But to further scale AI, we must also address thermal challenges in the power delivery path. By integrating liquid cooling into the power backbone with our new multi-channel liquid cooling busbar, customers can reduce thermal stress while maintaining stable electrical performance—without significantly increasing rack footprint.'

Multi-Channel Advantages

Unlike conventional liquid cooling designs that use a single-channel fluid path, Molex developed a proprietary multi-channel architecture that divides the cooling liquid path into seven independent channels. This approach not only extracts heat more uniformly and efficiently—reducing hot spots and thermal stress—but also enhances electrical performance stability under high current conditions. As a result, Molex's multi-channel liquid cooling busbar achieves superior thermal efficiency, with a temperature rise (T-Rise) of just 15°C at 15,000 amperes.

According to Molex's simulations, the 7-channel multi-channel liquid cooling busbar architecture improves cooling efficiency by up to 20% compared to single-channel designs. By maximizing heat extraction within the same installation space, data center designers can expand power capacity without sacrificing valuable rack space.

Flexible Modular Design

Molex developed a new busbar that offers unprecedented configuration flexibility, allowing customers to adjust the length, depth, and inlet/outlet positions of the cooling liquid to accommodate constrained space layouts. Combined with a standard plug-and-play interface, this flexibility enables seamless transition to liquid cooling without redesigning rack infrastructure.

Future-Proof Investment Protection

By maintaining footprint compatibility with ORV3 and HPR mechanical standards, Molex simplifies system integration and contributes to the reliability of data center and AI rack applications. Hyperscalers can easily transition to next-generation accelerators and 1-MW rack architectures while pre-deploying high-capacity power infrastructure needed for the long term.

This ensures that as power demands grow from the current 15,000 amperes to 25,000 amperes, costly full-scale redesigns are unnecessary. Additionally, compatibility with both dielectric and non-dielectric liquids allows these solutions to be seamlessly integrated into various existing cooling loops. Molex's multi-channel liquid cooling busbar builds on decades of thermal management expertise, enabling customers to protect their investments in existing platforms while gradually transitioning from air cooling to liquid cooling.

Computex 2026: Molex Innovation Showcase

At Computex 2026, Molex showcased innovations supporting next-generation AI infrastructure, including a real-time thermal mapping demo of the multi-channel liquid cooling busbar, proving its effectiveness in high-density AI workload simulation environments. Molex also introduced the following technologies, built on its expertise in advanced power delivery, efficient thermal management, and high-speed connectivity:

• Integrated rack solutions with advanced cooling capabilities: Innovations that address thermal constraints while tackling energy consumption challenges.
• 448G high-speed connectivity: Solutions designed to support next-generation data transmission within AI servers.
• CPO, CPC, and XPO connection solution portfolios: Co-packaged and optical solutions that support scale-up architectures, reducing power consumption and signal loss while achieving higher interconnection density.
• Innovative optical solutions: Fiber connection innovations and solutions from Teramount, now part of Molex, supporting the expansion of high-density optical infrastructure.

About Molex

Molex empowers a connected world by enabling technologies that transform the future and enrich lives. With operations in over 40 countries, Molex drives innovation across consumer devices, aerospace and defense, data centers, cloud, telecom, transportation, industrial automation, and healthcare. Through trusted customer and industry relationships, engineering excellence, and a commitment to quality and reliability, Molex pursues infinite possibilities. Creating Connections for Life—beyond solution development, envisioning a connected future. For more details, visit www.molex.com.