JMTC's Development of MXene-Reinforced Filler for Die Bonding Materials Selected for the 'Startup Intellectual Property Support Grant Program'
Japan Material Technologies Corporation's development of MXene fillers for next-generation power semiconductor bonding materials has been selected for Tokyo's startup IP support grant.
📋 Article Processing Timeline
- 📰 Published: April 8, 2026 at 17:00
- 🔍 Collected: April 8, 2026 at 08:30
- 🤖 AI Analyzed: April 21, 2026 at 01:37 (305h 6m after Collected)
Japan Material Technologies Corporation (JMTC; Headquarters: Chuo-ku, Tokyo; President and CEO: Okimasa Urata; hereinafter "the Company") is pleased to announce that its proposal, "Development of MXene-reinforced Filler for Die Bonding Materials," has been selected for the "Startup Intellectual Property Support Grant Program" implemented by the Tokyo Metropolitan Small and Medium Enterprise Support Center.
This program is a system that supports startup companies with excellent technologies and ideas in commercialization utilizing intellectual property and establishing competitive advantages. The Company will utilize the MXene materials it is developing to promote the development of bonding materials corresponding to the high-temperature operation of next-generation power semiconductors and the strengthening of related intellectual property strategies.
While next-generation power semiconductors such as SiC and GaN are said to be capable of operating in high-temperature environments of 300°C or higher, current operation is limited to around 175°C due to packaging technology constraints. In particular, the reliability of the joint between the semiconductor chip and the substrate is a critical issue, and interface peeling and material destruction are major causes of device failure. To solve these issues, the development of bonding materials with high bonding strength and reliability even in high-temperature environments is required. In this research, we aim to improve the bonding strength and reliability of semiconductor packages by adding the MXene we are developing to the bonding material. This technology is expected to realize semiconductor packaging materials that possess stable bonding performance even in high-temperature environments.
Through this project, Japan Material Technologies Corporation will contribute to the establishment of packaging material technologies that support the high-temperature operation of next-generation power semiconductors and accelerate the social implementation of MXene materials.
## Contact for inquiries regarding this matter
Japan Material Technologies Corporation Inquiry Form: https://www.jmtc.co.jp/contact/
## Overview of Japan Material Technologies Corporation
- Company Name: Japan Material Technologies Corporation
- Established: August 2015
- Capital: 300 million yen *including capital reserve
- Representative: President and CEO Okimasa Urata
- Business Description: Functional Materials Business
- Corporate Website: https://www.jmtc.co.jp
This program is a system that supports startup companies with excellent technologies and ideas in commercialization utilizing intellectual property and establishing competitive advantages. The Company will utilize the MXene materials it is developing to promote the development of bonding materials corresponding to the high-temperature operation of next-generation power semiconductors and the strengthening of related intellectual property strategies.
While next-generation power semiconductors such as SiC and GaN are said to be capable of operating in high-temperature environments of 300°C or higher, current operation is limited to around 175°C due to packaging technology constraints. In particular, the reliability of the joint between the semiconductor chip and the substrate is a critical issue, and interface peeling and material destruction are major causes of device failure. To solve these issues, the development of bonding materials with high bonding strength and reliability even in high-temperature environments is required. In this research, we aim to improve the bonding strength and reliability of semiconductor packages by adding the MXene we are developing to the bonding material. This technology is expected to realize semiconductor packaging materials that possess stable bonding performance even in high-temperature environments.
Through this project, Japan Material Technologies Corporation will contribute to the establishment of packaging material technologies that support the high-temperature operation of next-generation power semiconductors and accelerate the social implementation of MXene materials.
## Contact for inquiries regarding this matter
Japan Material Technologies Corporation Inquiry Form: https://www.jmtc.co.jp/contact/
## Overview of Japan Material Technologies Corporation
- Company Name: Japan Material Technologies Corporation
- Established: August 2015
- Capital: 300 million yen *including capital reserve
- Representative: President and CEO Okimasa Urata
- Business Description: Functional Materials Business
- Corporate Website: https://www.jmtc.co.jp
FAQ
What is the purpose of the MXene-reinforced filler being developed by Nippon Material Technology Research?
To improve the strength and reliability of the bonding between semiconductor chips and substrates, allowing next-generation power semiconductors like SiC and GaN to operate in high-temperature environments over 300°C.
What is MXene (Maxine)?
It is a type of next-generation two-dimensional nanomaterial that Nippon Material Technology Research is applying as an additive (filler) in bonding materials.
What grant program was selected this time?
The grant program is the 'Startup Intellectual Property Support Subsidy' implemented by the Tokyo Metropolitan SME Promotion Corporation, which supports the commercialization of technology and the establishment of competitive advantages.