Press Release: 'Guideline on Data Collaboration Mechanisms for Supply Chain Resilience (Automotive Semiconductors) Version 0.1' Published

Release Date: June 16, 2026

Information-Technology Promotion Agency (IPA)

The Information-Technology Promotion Agency (IPA, Chairman: Hiroshi Saito) has published the 'Guideline on Data Collaboration Mechanisms for Supply Chain Resilience (Automotive Semiconductors) Version 0.1'. This guideline defines the business and functional requirements necessary for cross-supply chain data collaboration and utilization to ensure stable semiconductor procurement across various industries. It aims to promote appropriate product selection and switching based on technological trends and market dynamics in the automotive and other related industries, thereby contributing to industrial competitiveness through stable semiconductor supply. Version 0.1 focuses on automotive semiconductors—critical components in Japan’s key automotive industry—and will gradually expand its scope to other areas.

Guideline available here

IPA Official Website

Background

Manufacturing supply chains have become increasingly globalized and complex. Due to factors such as pandemics, natural disasters, regulatory changes, and rising geopolitical risks, it has become more difficult to predict disruptions in advance. In the semiconductor sector, supply shortages and tightness have made it challenging to forecast supply-demand balances. Amid this growing uncertainty, procurement teams must promptly grasp available supply volumes and lead times to secure multiple sourcing options and alternatives, enabling rapid decision-making. On the supply side, it is essential to establish production plans and inventory strategies based on fluctuating demand and constraints, as well as to proactively communicate product lineup forecasts. To address these challenges through supply chain resilience, the IPA’s Digital Architecture & Design Center (DADC) has released the 'Guideline on Data Collaboration Mechanisms for Supply Chain Resilience (Automotive Semiconductors) Version 0.1' to promote initiatives leveraging data spaces.

Overview

This guideline defines the business and functional requirements needed for inter-company data collaboration and utilization, regardless of direct business relationships. Participants in a data space can reference data based on access controls defined by data providers, under the trust established through contractual agreements with the data space operator. In the semiconductor data platform covered by this guideline, semiconductor manufacturers can register information essential for stable automotive semiconductor procurement into the data space, enabling automotive OEMs and parts manufacturers to access it as needed. Specifically, the platform handles supply-forecasting information such as part numbers, specifications, End-of-Life (EOL) notices, recommended/non-recommended product transitions, and production site details related to supply capacity. Since data providers can specify and control both the recipients and the data items disclosed, semiconductor manufacturers can efficiently share necessary information with automotive OEMs and parts suppliers while protecting trade secrets. This enables efficient and timely information sharing even in uncertain environments, facilitating rapid decision-making for alternative sourcing and production planning adjustments, thereby strengthening the supply chain.

Furthermore, this guideline consolidates the outcomes of the 'Demonstration and Support Project for Data Collaboration Infrastructure in Automotive Component Supply Chains (e.g., Semiconductors), Toward CASE Mobility such as Autonomous Driving,' implemented by the Ministry of Economy, Trade and Industry (METI) in FY2025. Its objective is to promote cross-enterprise sharing and utilization of supply chain and value chain data through data spaces. Version 0.1 outlines the conceptual design targeting automotive semiconductors in the automotive industry. Future versions will progressively include broader applications to general semiconductors and non-automotive industries, as well as detailed designs and operational frameworks.

Prior to the release of version 0.1, IPA incorporated feedback from a public comment period held from April 2 to May 7, 2026. Updates will be made as necessary in response to evolving circumstances, such as the social implementation of related data spaces.

For more details, please visit the IPA official website.

Guideline on Data Collaboration Mechanisms for Supply Chain Resilience

IPA will promote appropriate product selection and switching based on industry trends and technological developments through the utilization of this document, contributing to enhanced industrial competitiveness via stable semiconductor supply.

Reference Information

Mobility DX Strategy / Mobility DX Discussion Committee (METI)

Open Data Spaces (IPA)

Inquiries

For inquiries regarding this announcement:

IPA Digital Architecture & Design Center: Shioiri, Horiuchi

E-mail: dadc-info@ipa.go.jp

For media inquiries:

IPA Strategic Communication Office, Strategic Communication Department, Management Planning Center: Watanabe, Kamata, Masuda

TEL: +81-3-5978-7503

Inquiry Form: info.ipa.go.jp/form/pub/inquire/pr-inquiries