Taise Corporation Begins Handling Cutting-Edge Photonics Products, Including Next-Generation "Hollow Core Fiber" for AI Data Centers and 6G
Taise Corporation has started to handle state-of-the-art optical communication and photonics products aimed at the rapidly growing demand for data center communication driven by generative AI and cloud services. The company is particularly focusing on "Hollow Core Fiber (HCF)," a next-generation technology that offers lower latency and loss compared to conventional optical fibers. By securing a stable supply of components, such as those from Optoweave, which have been difficult to source in Japan, Taise aims to support everything from R&D to mass production, contributing to the development of Japan's next-generation communication technology.
📋 Article Processing Timeline
- 📰 Published: May 18, 2026 at 20:44
- 🔍 Collected: May 18, 2026 at 12:01
- 🤖 AI Analyzed: May 18, 2026 at 12:06 (4 min after Collected)
Taise Corporation (HQ: Kamagaya City, Chiba) has newly begun handling various products for research, development, and mass production in the optical communication and photonics fields.
As a background, the rapid spread of generative AI and cloud services has led to a global expansion in the need for higher speed and larger capacity in data center communications. In this context, Hollow Core Fiber (HCF) is anticipated as a next-generation optical fiber that transmits light through "air" instead of glass. Compared to conventional silica optical fibers, it features low latency, low loss, and low non-linearity, and is expected to be implemented in AI data centers, 6G communications, and quantum communications. It is being demonstrated in large-scale data centers like Microsoft Azure, and major manufacturers like YOFC are developing it for mass production.
However, in Japan, there have been procurement challenges, such as difficulty in obtaining HCF fibers with the required specifications and complexities in dealing with overseas manufacturers.
To meet these needs, Taise Corporation has started handling various photonics-related products, including those from Optoweave, and will provide support for the procurement and technical selection of HCF and related components.
[Product Lineup]
■ Optoweave Advanced Photonics Products:
・3D Photonic Interconnect Chips
・Hollow Core Fiber (HCF)
・Hollow Core Fiber Connectors
・FA Fiber Arrays, etc.
*Also compatible with HCF from other manufacturers like YOFC.
■ ETSC Inspection and Assembly Equipment:
・Photonic Automatic Optical Inspection (AOI)
・Opto-electronic Wafer Test Systems
・Photonic Chip Test Systems, etc.
■ Other Handled Products:
・MEMS Optical Switches (from Amaze Link)
By offering optimal configuration proposals tailored to customer applications, from R&D to mass production consideration, we will contribute to the development of the next-generation optical communication and advanced photonics fields.
As a background, the rapid spread of generative AI and cloud services has led to a global expansion in the need for higher speed and larger capacity in data center communications. In this context, Hollow Core Fiber (HCF) is anticipated as a next-generation optical fiber that transmits light through "air" instead of glass. Compared to conventional silica optical fibers, it features low latency, low loss, and low non-linearity, and is expected to be implemented in AI data centers, 6G communications, and quantum communications. It is being demonstrated in large-scale data centers like Microsoft Azure, and major manufacturers like YOFC are developing it for mass production.
However, in Japan, there have been procurement challenges, such as difficulty in obtaining HCF fibers with the required specifications and complexities in dealing with overseas manufacturers.
To meet these needs, Taise Corporation has started handling various photonics-related products, including those from Optoweave, and will provide support for the procurement and technical selection of HCF and related components.
[Product Lineup]
■ Optoweave Advanced Photonics Products:
・3D Photonic Interconnect Chips
・Hollow Core Fiber (HCF)
・Hollow Core Fiber Connectors
・FA Fiber Arrays, etc.
*Also compatible with HCF from other manufacturers like YOFC.
■ ETSC Inspection and Assembly Equipment:
・Photonic Automatic Optical Inspection (AOI)
・Opto-electronic Wafer Test Systems
・Photonic Chip Test Systems, etc.
■ Other Handled Products:
・MEMS Optical Switches (from Amaze Link)
By offering optimal configuration proposals tailored to customer applications, from R&D to mass production consideration, we will contribute to the development of the next-generation optical communication and advanced photonics fields.