DNP to Exhibit at ECTC 2026, Showcasing Next-Gen Glass Core Substrates and CPO Technologies

DNP (Dai Nippon Printing) has positioned its semiconductor business as a key focus area, expanding existing operations while developing new ventures. At ECTC 2026, the company will introduce semiconductor-related products developed using its core processing expertise, including metal and glass etching and functional plating technologies derived from its printing heritage.

Specifically, DNP will exhibit and present solutions for next-generation packaging, such as 'Glass Core Substrates,' thin metal 'Vapor Chambers,' and 'Co-Packaged Optics' (CPO) technologies. these address global trends and challenges like rising power consumption from AI and the need for higher efficiency and larger packaging substrates.

[ECTC 2026 Overview and Exhibition Details]
- Dates: May 26 (Tue) – 29 (Fri), 2026
*Conference: May 26–29; Exhibition: May 27–28
- Venue: JW Marriott & The Ritz-Carlton Grande Lakes Resort
- DNP Booth: 1104

[DNP's Main Presentations and Exhibits]
- Technical Paper Presentations (Local Time):
*May 28, 11:35–11:55: 'High-Density Polymer Waveguide Integration on Glass Substrate for CPO'
*May 28, 16:05–16:25: 'Development of Long-Term Reliability for Glass Core Substrates with Build-Up Layers'

- Key Exhibits:
*TGV (Through Glass Via) Glass Core Substrates for Next-Gen Packaging:
By replacing conventional resin with glass, these substrates enable high-performance semiconductor packages through high-density TGVs, supporting large-area and high-efficiency requirements.

*Ultra-thin Metal Heat Dissipation Member 'Vapor Chamber':
A heat-spreading component utilizing the vaporization and condensation of water. DNP has developed a version that combines high thermal conductivity and a thin profile with the ability to be bent flexibly.