[Press Release] New COM Express Module with Intel Core Series 3 Processors Optimizes Cost and Energy Efficiency for Embedded Computing Applications
Congatec announced the 'conga-TC300' COM Express Compact module, featuring Intel Core Series 3 processors. This module provides dedicated AI accelerators and up to 41 TOPS of AI performance for low-power embedded and industrial edge AI applications, facilitating easy upgrades from existing systems.
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- 📰 Published: April 28, 2026 at 19:00
- 🔍 Collected: April 28, 2026 at 10:31
- 🤖 AI Analyzed: April 28, 2026 at 14:42 (4h 10m after Collected)
This press release is an abridged translation of a press release announced by congatec GmbH in Germany on April 16, 2026 (local time).
Congatec, a leading provider of embedded and edge computing technologies, has announced the 'conga-TC300' Computer-on-Module (COM) in the COM Express Compact form factor, featuring Intel Core Series 3 processors (codename: Wildcat Lake). This marks the first time that dedicated AI accelerators are available in application-ready aReady.COM modules for the low-power, entry-level segment of x86-based embedded and industrial edge applications. These modules are an ideal upgrade for embedded designs that previously used Intel Atom or Celeron platforms, extending them with dedicated AI capabilities. The conga-TC300 is specifically designed for cost-sensitive edge AI applications in markets such as robotics, industrial automation, medical technology, transportation, smart cities, and retail/POS.
The new modules, powered by Intel Core Series 3 processors, bring numerous high-end features to the entry-level segment. This includes improved energy efficiency with two performance cores (P-cores) and four low-power efficient cores (LP E-cores), achieving up to 5 TOPS of performance with Intel 18A. It is also the first Intel Core processor to feature a dedicated NPU delivering up to 18 TOPS of performance. Furthermore, it includes up to two Xe3 graphics cores for GPGPU-accelerated AI applications, also providing up to 18 TOPS of performance. Developers can utilize a total AI performance of up to 41 TOPS. All of this is contained within an economical and scalable thermal design power (TDP) of 12W to 28W (base TDP is 15W) to support various use cases.
"The conga-TC300 provides a reliable upgrade path to new AI functionalities for low-power and lightweight AI applications, with a supply availability of up to 10 years. With this new COM Express module, equipment manufacturers can easily integrate new AI capabilities into applications such as autonomous guided vehicles (AGVs) and autonomous mobile robots (AMRs), intelligent machine control, HMIs, patient data monitoring systems (PDMS), surveillance systems, and check-in/check-out terminals. For developers seeking cost-efficient and energy-efficient AI performance, including local voice or gesture control, AI-assisted object recognition and identification, and LLM-based conversational functions, the conga-TC300 will be a very attractive product," explains Jürgen Jungbauer, Senior Product Line Manager at congatec.
Module Details
The conga-TC300 supports up to 64 GB of DDR memory (up to 6400 MT/s) with optional in-band error correction code (IBECC). An optional onboard UFS 3.1 storage option of up to 512 GB is also available. Network applications can leverage 2.5 Gigabit Ethernet (GbE), with optional support for Time Coordinated Computing (TCC) and Time-Sensitive Networking (TSN). For high-speed data transfer and connecting low-lane peripherals such as Ethernet and fieldbus adapters, and wireless modules, up to eight freely configurable PCIe lanes are available. This eliminates the need for additional PCIe switches on the carrier board, further simplifying design.
Congatec, a leading provider of embedded and edge computing technologies, has announced the 'conga-TC300' Computer-on-Module (COM) in the COM Express Compact form factor, featuring Intel Core Series 3 processors (codename: Wildcat Lake). This marks the first time that dedicated AI accelerators are available in application-ready aReady.COM modules for the low-power, entry-level segment of x86-based embedded and industrial edge applications. These modules are an ideal upgrade for embedded designs that previously used Intel Atom or Celeron platforms, extending them with dedicated AI capabilities. The conga-TC300 is specifically designed for cost-sensitive edge AI applications in markets such as robotics, industrial automation, medical technology, transportation, smart cities, and retail/POS.
The new modules, powered by Intel Core Series 3 processors, bring numerous high-end features to the entry-level segment. This includes improved energy efficiency with two performance cores (P-cores) and four low-power efficient cores (LP E-cores), achieving up to 5 TOPS of performance with Intel 18A. It is also the first Intel Core processor to feature a dedicated NPU delivering up to 18 TOPS of performance. Furthermore, it includes up to two Xe3 graphics cores for GPGPU-accelerated AI applications, also providing up to 18 TOPS of performance. Developers can utilize a total AI performance of up to 41 TOPS. All of this is contained within an economical and scalable thermal design power (TDP) of 12W to 28W (base TDP is 15W) to support various use cases.
"The conga-TC300 provides a reliable upgrade path to new AI functionalities for low-power and lightweight AI applications, with a supply availability of up to 10 years. With this new COM Express module, equipment manufacturers can easily integrate new AI capabilities into applications such as autonomous guided vehicles (AGVs) and autonomous mobile robots (AMRs), intelligent machine control, HMIs, patient data monitoring systems (PDMS), surveillance systems, and check-in/check-out terminals. For developers seeking cost-efficient and energy-efficient AI performance, including local voice or gesture control, AI-assisted object recognition and identification, and LLM-based conversational functions, the conga-TC300 will be a very attractive product," explains Jürgen Jungbauer, Senior Product Line Manager at congatec.
Module Details
The conga-TC300 supports up to 64 GB of DDR memory (up to 6400 MT/s) with optional in-band error correction code (IBECC). An optional onboard UFS 3.1 storage option of up to 512 GB is also available. Network applications can leverage 2.5 Gigabit Ethernet (GbE), with optional support for Time Coordinated Computing (TCC) and Time-Sensitive Networking (TSN). For high-speed data transfer and connecting low-lane peripherals such as Ethernet and fieldbus adapters, and wireless modules, up to eight freely configurable PCIe lanes are available. This eliminates the need for additional PCIe switches on the carrier board, further simplifying design.