Compal to Showcase Integrated AI Infrastructure Solutions at COMPUTEX

(CNA, reporter Wu Chia-hao, Taipei, 20th) OEM manufacturer Compal announced today its collaboration with AI infrastructure provider Exascale Labs. They plan to showcase a new generation of integrated Artificial Intelligence (AI) infrastructure solutions at the 2026 Taipei International Computer Show (COMPUTEX), continuing to expand their technical capabilities and layout in the fields of AI servers, liquid cooling, and data center infrastructure integration. Compal stated in a press release that as AI workloads grow rapidly, the demand for high power consumption and high heat density continues to raise the requirements for power and cooling architectures in data centers. Compal is expanding from traditional server manufacturing to integrated AI infrastructure solutions, providing cloud service providers, enterprises, and large-scale AI factories with a more complete and rapidly deployable AI infrastructure platform. Through the partnership with Exascale Labs, Compal can further strengthen its integration capabilities in computing, cooling, and power infrastructure. Chang Yao-wen, Vice President of Compal's Infrastructure Business Group, said that the development of AI infrastructure is no longer just a competition of single-server performance; customers increasingly need an all-in-one integrated solution covering computing, cooling, and power. Chang stated that by combining Compal's AI server and liquid cooling technology with Exascale's modular infrastructure and High-Voltage Direct Current (HVDC) capabilities, Compal can help customers deploy scalable AI infrastructure more quickly and efficiently.