Research: Micro LED Optical Transceiver Module Market Value to Exceed US$800 Million by 2030

According to TrendForce, the market value of Micro LED Co-Packaged Optics (CPO) modules is projected to reach US$848 million by 2030, driven by the rapidly growing demand for high-speed optical communication from generative AI. Several suppliers are forming alliances, with a significant increase in module shipments expected by the second half of 2028.
調査NQ 0/100出典:PR Times

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  • 📰 Published: May 11, 2026 at 16:31
  • 🔍 Collected: May 11, 2026 at 17:02 (30 min after Published)
  • 🤖 AI Analyzed: May 11, 2026 at 18:36 (1h 34m after Collected)
Central News Agency

(Central News Agency reporter Pan Chih-tung, Taipei, 11th) According to the latest Micro LED industry research by TrendForce, the rapid rise in demand for high-speed optical communication driven by generative AI is expected to push the market value of Micro LED Co-Packaged Optics (CPO) modules to US$848 million by 2030.

TrendForce stated that as multiple suppliers form alliances, and considering the time required for product specification formulation, sampling, and verification processes, the shipment volume of Micro LED optical transceiver modules is expected to significantly increase as early as the second half of 2028.

TrendForce explained that the global supply chain is actively deploying in the optical communication and optical interconnect fields. For instance, Microsoft's MOSAIC proposes a Micro LED Co-Packaged Optics (CPO) module architecture, with MediaTek providing an Active Optical Cable (AOC) integration solution. Credo, a leading Active Electrical Cable (AEC) vendor, acquired Hyperlume in Q3 2025 to expand its optical interconnect product portfolio.

Startup Avicena has developed ultra-low power LightBundle technology and is prepared to launch 512 Gbps Micro LED optical interconnects, advancing to an 896 Gbps solution in Q2 2026, continuously improving data transmission efficiency and power performance. ams OSRAM signed a development agreement with a leading global AI data center infrastructure partner to advance the commercialization of Micro LED optical interconnects, independently developing a Micro LED-based optical interconnect solution targeting a 2027 launch. This solution is expected to integrate Micro LED chips, optical components, and dedicated Application-Specific Integrated Circuits (ASICs).

In addition, AUO integrates technology from Epistar and Lextar to introduce Micro LED Co-Packaged Optics (CPO) modules into Glass RDL Interposers for direct customer use, eliminating the need for additional mass transfer equipment. Innolux is expected to leverage the advantages of Bemc (First-Act Optoelectronics) to acquire Micro LED resources, gradually establishing vertical integration capabilities and competitive barriers.

PlayNitride has partnered with OptoLoop, while BOE HC SemiTek chose to collaborate with Shanghai New Vision Microelectronics to focus on Micro LED optical interconnects. (Editor: Yang Kai-xiang) 1150511

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