Innolux's Fan-Out Panel-Level Packaging Layout Succeeds, Stock Price Surges to Limit Up
Innolux's FOPLP technology has entered SpaceX's supply chain, and market rumors suggest a collaboration with TSMC for AI and HPC. This led to Innolux's stock price hitting the limit up, while AUO also saw significant gains.
📋 Article Processing Timeline
- 📰 Published: May 11, 2026 at 12:02
- 🔍 Collected: May 11, 2026 at 12:32 (29 min after Published)
- 🤖 AI Analyzed: May 11, 2026 at 13:03 (30 min after Collected)
Central News Agency
(Central News Agency reporter Pan Chih-yi, Taipei, 11th) Following Innolux's successful entry into the supply chain of low-earth orbit satellite giant SpaceX with its Fan-Out Panel-Level Packaging (FOPLP) technology, market rumors suggest that TSMC is also planning to collaborate with Innolux in the field of fan-out panel packaging for AI and high-performance computing. Innolux's stock price surged to its limit up at NT$32.3 during intraday trading today, while AUO also rose sharply by over 7% to NT$19.1.
In Innolux's latest uploaded annual report for shareholders' meeting, Chairman Hong Jin-yang explained in the "Report to Shareholders" that Innolux has achieved remarkable results in 13 technology areas; among them, advanced packaging is the most notable, emphasizing that Innolux's semiconductor advanced packaging technology "has already taken a leading position" and has proactively deployed in the Through-Glass Via (TGV) field, collaborating with top-tier global clients to develop technology and seize opportunities in AI and high-performance computing.
Hong Jin-yang previously stated that the primary goal of Innolux's fan-out panel-level packaging products entering the supply chain of international low-earth orbit satellite giants was not profit, but rather to gain "certification" from major manufacturers, which would be beneficial for securing orders from other major manufacturers in the future.
Innolux stated at its investor conference that the current monthly shipments of fan-out panel-level packaging have reached 10 times that of last year, and the shipment momentum is expected to continue into the second half of the year. Currently, only Innolux is mass-producing this technology, and the company does not wish to expand too quickly to avoid repeating the dilemma of price competition caused by rapid expansion in the panel industry.
Panel manufacturer AUO also stated that it has been investing in fan-out panel-level packaging technology research and development for many years, but currently prioritizes promoting the application of Micro LED in displays and even optical communications, with Co-Packaged Optics (CPO) applications attracting attention. (Editor: Chang Liang-chih) 1150511
Choose to stand with facts, every sponsorship you make is a force to protect press freedom.
Download the Central News Agency "First-hand News" APP to get the latest news in real time.
The text, images, and audio/video on this website may not be reproduced, publicly broadcast, publicly transmitted, or utilized without authorization.
(Central News Agency reporter Pan Chih-yi, Taipei, 11th) Following Innolux's successful entry into the supply chain of low-earth orbit satellite giant SpaceX with its Fan-Out Panel-Level Packaging (FOPLP) technology, market rumors suggest that TSMC is also planning to collaborate with Innolux in the field of fan-out panel packaging for AI and high-performance computing. Innolux's stock price surged to its limit up at NT$32.3 during intraday trading today, while AUO also rose sharply by over 7% to NT$19.1.
In Innolux's latest uploaded annual report for shareholders' meeting, Chairman Hong Jin-yang explained in the "Report to Shareholders" that Innolux has achieved remarkable results in 13 technology areas; among them, advanced packaging is the most notable, emphasizing that Innolux's semiconductor advanced packaging technology "has already taken a leading position" and has proactively deployed in the Through-Glass Via (TGV) field, collaborating with top-tier global clients to develop technology and seize opportunities in AI and high-performance computing.
Hong Jin-yang previously stated that the primary goal of Innolux's fan-out panel-level packaging products entering the supply chain of international low-earth orbit satellite giants was not profit, but rather to gain "certification" from major manufacturers, which would be beneficial for securing orders from other major manufacturers in the future.
Innolux stated at its investor conference that the current monthly shipments of fan-out panel-level packaging have reached 10 times that of last year, and the shipment momentum is expected to continue into the second half of the year. Currently, only Innolux is mass-producing this technology, and the company does not wish to expand too quickly to avoid repeating the dilemma of price competition caused by rapid expansion in the panel industry.
Panel manufacturer AUO also stated that it has been investing in fan-out panel-level packaging technology research and development for many years, but currently prioritizes promoting the application of Micro LED in displays and even optical communications, with Co-Packaged Optics (CPO) applications attracting attention. (Editor: Chang Liang-chih) 1150511
Choose to stand with facts, every sponsorship you make is a force to protect press freedom.
Download the Central News Agency "First-hand News" APP to get the latest news in real time.
The text, images, and audio/video on this website may not be reproduced, publicly broadcast, publicly transmitted, or utilized without authorization.