NICS and ASE Sign MOU to Build Semiconductor Cybersecurity Defense Wall

The National Institute of Cyber Security (NICS) and ASE Group signed a Memorandum of Understanding (MOU) today for national cybersecurity joint defense, information sharing, and cooperation. NICS stated that by sharing technical resources and linking real-time cybersecurity intelligence, they will strengthen the depth of cybersecurity defense for the semiconductor industry to respond to complex and changing global cyber threats, creating a more resilient protective wall for the semiconductor field.

The signing ceremony was held today with ASE Kaohsiung Vice General Manager Li Cheng-chieh and NICS President Lin Ying-da in attendance. Li Cheng-chieh expressed that signing the MOU with NICS symbolizes a move toward a more real-time and transparent joint defense phase. This mechanism allows for more sensitive warning of cyber threats and action to ensure the safety of smart manufacturing processes and core corporate assets.

Li stated that this alliance not only substantially strengthens ASE's technical defense energy but also builds a stable mutual trust line through cross-domain professional exchange, consolidating the enterprise's core competitive advantage under digital transformation trends. Lin Ying-da said ASE plays a key role in the semiconductor supply chain. NICS integrates resources and shares high-value threat intelligence to help companies respond quickly with precise warnings. NICS emphasized that in response to geopolitical risks, this cooperation strengthens digital resilience for industries in Kaohsiung and enhances the ability to detect and counter cyber threats proactively.