Nanya PCB: Operational Performance to Further Improve This Year, Expanding AI Server Substrate Production

Nanya PCB Chairman Chou Ming-jen expects the company's 2026 operational performance to surpass 2025, driven by the growth of AI-driven cloud and edge computing applications. Nanya PCB continues to expand its IC substrate and PCB product applications for AI servers and high-end switches. In IC substrate product development, Nanya PCB is deepening its layout in high-end computing substrates for GPUs, 1.6T switches, custom ASICs (TPUs), and embedded capacitor chips. For automotive electronics substrates, it has completed the development of high-end automotive control chip IC substrates. For mobile device application substrates, it is developing products for next-generation mobile devices and edge AI computing. For general PCBs, it is focusing on new generation mobile device interposers, high-end laptops, server solid-state drives, and LED light beads, actively expanding AI server-related products, and stably mass-producing PCBs for high-end GPU display cards and network cards. External challenges include the impact of US reciprocal tariffs on end-demand and the expansion of US export controls on semiconductors to China, leading to supply chain regionalization and increased operating costs. Opportunities arise from Taiwan's semiconductor supply chain's technological leadership and cluster effects, as well as cloud service providers (CSPs) accelerating independent ASIC development in response to growing customized big data AI computing demand.
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📋 Article Processing Timeline

  • 📰 Published: April 14, 2026 at 09:34
  • 🔍 Collected: April 14, 2026 at 10:01 (27 min after Published)
  • 🤖 AI Analyzed: April 15, 2026 at 19:51 (33h 50m after Collected)
Nanya PCB Chairman Chou Ming-jen stated that due to the growth in cloud and edge computing applications driven by artificial intelligence (AI), Nanya PCB's operational performance in 2026 is expected to further improve compared to 2025. Nanya PCB continues to expand its IC substrate and PCB product applications for AI servers and high-end switches. In terms of IC substrate product layout, Nanya PCB is deepening the development of high-end computing-related substrates for graphics processing units (GPUs), 1.6T switches, customized application-specific integrated circuits (TPUs), and embedded capacitor chips, expanding applications for AI servers and high-end switches. In automotive electronics substrates, Nanya PCB has collaborated with customers to complete the development of high-end automotive control chip IC substrates, increasing the proportion of high-value products. In mobile device application substrates, Nanya PCB noted the expanding scope of system-in-package (SiP) applications and is developing products for next-generation mobile devices and edge computing AI applications. In general PCBs, Nanya PCB is continuously developing products for new generation mobile device interposers, high-end laptops, server solid-state drives, and LED light beads, actively expanding AI server-related products, and stably mass-producing PCBs for high-end GPU display cards and network cards. Looking at the external competitive environment, Chou Ming-jen pointed out in his business report to shareholders that US reciprocal tariffs may affect end-demand, and the scope of US export controls on semiconductor equipment, technology, and and related products to China may expand, driving supply chain regionalization and diversification, and increasing operating costs, which are significant operational challenges for Taiwanese PCB and IC substrate manufacturers. Regarding Taiwan's industrial layout, Chou Ming-jen noted that Taiwan's semiconductor supply chain continues to lead technologically and possesses an industrial cluster effect, allowing international customers and local semiconductor manufacturers to deepen cooperation. As cloud service providers (CSPs) respond to the growing demand for customized big data AI computing and operating cost control, they are accelerating the independent development of application-specific integrated circuits (ASICs), which will create considerable potential business opportunities.