AI demand is too crazy, C.C. Wei: Tainan, US, Japan plants expanding 3nm production lines
To meet explosive AI demand, TSMC CEO C.C. Wei announced the expansion of 3nm production lines globally, with mass production planned in Tainan, Arizona (2027), and Kumamoto (2028), while also converting existing 5nm equipment to 3nm.
📋 Article Processing Timeline
- 📰 Published: April 16, 2026 at 16:20
- 🔍 Collected: April 16, 2026 at 16:31 (11 min after Published)
- 🤖 AI Analyzed: April 19, 2026 at 00:45 (56h 13m after Collected)
Central News Agency
(Central News Agency reporter Zhang Jianzhong, Hsinchu, 16th) TSMC Chairman and CEO C.C. Wei stated today that to meet the robust demand for artificial intelligence (AI) applications, TSMC is accelerating investments and enhancing its 3-nanometer capacity. It will add 3nm process production lines in the Southern Taiwan Science Park (STSP), the United States, and Japan, and will convert 5nm equipment in Taiwan to produce 3nm.
Wei said TSMC is adding 3nm process production lines in STSP, expecting mass production in the first half of 2027; the second plant in Arizona, USA, will also adopt the 3nm process, having completed construction, and is expected to mass-produce in the second half of 2027; as for the second plant in Kumamoto, Japan, it is also planned to adopt 3nm process technology, expecting mass production in 2028.
TSMC held an online institutional investors' conference today. To satisfy strong AI application demand and support stable 3nm needs for customers in AI, smartphones, automotive, and IoT, TSMC is executing a global capacity expansion plan.
Besides adding new production lines, Wei noted that TSMC is simultaneously converting Taiwan's 5nm process equipment to produce 3nm. TSMC is also improving production efficiency and increasing wafer output to fully support all customers. (Editor: Lin Shuyuan) 1150416
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(Central News Agency reporter Zhang Jianzhong, Hsinchu, 16th) TSMC Chairman and CEO C.C. Wei stated today that to meet the robust demand for artificial intelligence (AI) applications, TSMC is accelerating investments and enhancing its 3-nanometer capacity. It will add 3nm process production lines in the Southern Taiwan Science Park (STSP), the United States, and Japan, and will convert 5nm equipment in Taiwan to produce 3nm.
Wei said TSMC is adding 3nm process production lines in STSP, expecting mass production in the first half of 2027; the second plant in Arizona, USA, will also adopt the 3nm process, having completed construction, and is expected to mass-produce in the second half of 2027; as for the second plant in Kumamoto, Japan, it is also planned to adopt 3nm process technology, expecting mass production in 2028.
TSMC held an online institutional investors' conference today. To satisfy strong AI application demand and support stable 3nm needs for customers in AI, smartphones, automotive, and IoT, TSMC is executing a global capacity expansion plan.
Besides adding new production lines, Wei noted that TSMC is simultaneously converting Taiwan's 5nm process equipment to produce 3nm. TSMC is also improving production efficiency and increasing wafer output to fully support all customers. (Editor: Lin Shuyuan) 1150416
Choose to stand with facts, every sponsorship from you is the power to guard press freedom
Download the Central News Agency "First Hand News" APP to grasp the latest news instantly
The text, images, audio, and video on this website may not be reproduced, publicly broadcast, publicly transmitted, or utilized without authorization.