(Central News Agency reporter Zhang Jianzhong, Hsinchu, 16th) TSMC Chairman and CEO C.C. Wei stated today that to meet the robust demand for artificial intelligence (AI) applications, TSMC is accelerating investments and enhancing its 3-nanometer capacity. It will add 3nm process production lines in the Southern Taiwan Science Park (STSP), the United States, and Japan, and will convert 5nm equipment in Taiwan to produce 3nm.

Wei said TSMC is adding 3nm process production lines in STSP, expecting mass production in the first half of 2027; the second plant in Arizona, USA, will also adopt the 3nm process, having completed construction, and is expected to mass-produce in the second half of 2027; as for the second plant in Kumamoto, Japan, it is also planned to adopt 3nm process technology, expecting mass production in 2028.

TSMC held an online institutional investors' conference today. To satisfy strong AI application demand and support stable 3nm needs for customers in AI, smartphones, automotive, and IoT, TSMC is executing a global capacity expansion plan.

Besides adding new production lines, Wei noted that TSMC is simultaneously converting Taiwan's 5nm process equipment to produce 3nm. TSMC is also improving production efficiency and increasing wafer output to fully support all customers. (Editor: Lin Shuyuan) 1150416

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  • Source: CNA (Central News Agency)
  • Category: New Product