Nanya PCB: Operational Performance to Further Improve This Year, Expanding AI Server Substrate Production

Nanya PCB Chairman Chou Ming-jen stated that due to the growth in cloud and edge computing applications driven by artificial intelligence (AI), Nanya PCB's operational performance in 2026 is expected to further improve compared to 2025. Nanya PCB continues to expand its IC substrate and PCB product applications for AI servers and high-end switches. In terms of IC substrate product layout, Nanya PCB is deepening the development of high-end computing-related substrates for graphics processing units (GPUs), 1.6T switches, customized application-specific integrated circuits (TPUs), and embedded capacitor chips, expanding applications for AI servers and high-end switches. In automotive electronics substrates, Nanya PCB has collaborated with customers to complete the development of high-end automotive control chip IC substrates, increasing the proportion of high-value products. In mobile device application substrates, Nanya PCB noted the expanding scope of system-in-package (SiP) applications and is developing products for next-generation mobile devices and edge computing AI applications. In general PCBs, Nanya PCB is continuously developing products for new generation mobile device interposers, high-end laptops, server solid-state drives, and LED light beads, actively expanding AI server-related products, and stably mass-producing PCBs for high-end GPU display cards and network cards. Looking at the external competitive environment, Chou Ming-jen pointed out in his business report to shareholders that US reciprocal tariffs may affect end-demand, and the scope of US export controls on semiconductor equipment, technology, and and related products to China may expand, driving supply chain regionalization and diversification, and increasing operating costs, which are significant operational challenges for Taiwanese PCB and IC substrate manufacturers. Regarding Taiwan's industrial layout, Chou Ming-jen noted that Taiwan's semiconductor supply chain continues to lead technologically and possesses an industrial cluster effect, allowing international customers and local semiconductor manufacturers to deepen cooperation. As cloud service providers (CSPs) respond to the growing demand for customized big data AI computing and operating cost control, they are accelerating the independent development of application-specific integrated circuits (ASICs), which will create considerable potential business opportunities.