TSMC Focuses on CoPoS: TrendForce Says Equipment and Material Suppliers Enter Critical Validation Phase

Artificial intelligence (AI) is accelerating the evolution of advanced packaging technologies. Market research firm TrendForce reports that TSMC is currently focusing on CoPoS (Chip-on-Panel-on-Substrate), with pilot production expected in 2027 and mass production scheduled for the second half of 2028. The year 2026 is anticipated to be a critical validation phase for related equipment and material suppliers.

TrendForce notes that TSMC's next-stage focus will be on glass core substrates. However, multiple technical challenges remain, particularly in the core through-glass via (TGV) process, which must overcome inconsistent via diameters due to unstable laser energy, micro-cracks generated during drilling, etching solutions struggling to penetrate deep into vias affecting conductivity, and dynamic alignment precision under large-scale mass production conditions.

On the materials front, while glass inherently offers excellent flatness, maintaining nanoscale flatness across the entire surface becomes significantly more difficult as substrate size increases. Additionally, mismatched coefficients of thermal expansion in multi-layer heterogeneous material stacking may cause warpage during processing, impacting exposure alignment accuracy and overall yield.

TrendForce highlights that Taiwan's panel manufacturers hold a first-mover advantage, with some already achieving mass production of FOPLP for mature processes such as power management and RF chips. This not only maximizes the residual value of fully depreciated large-size panel production lines but also generates additional cash flow.

The firm emphasizes that years of accumulated expertise in large-size square glass handling, alignment, and uniform deposition provide a crucial foundation for advancing core substrate processing technologies like TGV. This creates clear differentiation and complementary opportunities between panel makers, semiconductor firms, and packaging providers.

Local Taiwanese material and equipment suppliers are also entering the space. Specialty chemical firms have introduced low-temperature curing dielectric materials, reducing process temperatures below 180°C to minimize thermal stress accumulation and warpage risk at the source. Equipment vendors are adopting a two-stage drilling process—laser modification followed by etching—which offers more precise via shape control compared to traditional direct laser ablation. This approach has already passed validation by international integrated device manufacturers, with shipment volumes gradually increasing. (Editor: Chang Liang-chih) 1150617