Hiwin Adopts Qualcomm Solution, Showcases Intelligent PLP Equipment at COMPUTEX

COMPUTEX 2026 will open on the 2nd. Transmission component giant Hiwin announced today that it will participate in the exhibition for the first time, showcasing achievements in AI robots and smart manufacturing. Hiwin also announced that it will partner with Qualcomm to jointly demonstrate an intelligent solution for large-scale Panel Level Packaging (PLP) equipment. According to Hiwin's press release, this collaboration introduces Qualcomm's Dragonwing Q6 edge AI into the Load Port, combined with smart vision to strengthen real-time monitoring, state recognition, and anomaly detection capabilities of the equipment's front-end modules. Hiwin stated that it has long been deeply involved in key modules for semiconductor equipment and possesses integration capabilities for Load Ports, Wafer Robots, and Equipment Front End Modules (EFEM). By combining edge AI with smart image sensing technology, the company achieves precision in carrier alignment and transport, deepening autonomous judgment and real-time correction capabilities in high-speed operating environments, helping customers reduce the risk of abnormal downtime and improve equipment utilization and process stability. During COMPUTEX, in addition to the PLP semiconductor smart equipment solution, Hiwin will also exhibit dual-arm logistics robots, core modules for humanoid robots, and smart gripper technology. Hiwin will also display humanoid robots driven by core technologies, presenting the practical application of precision transmission, actuation, and motion control modules in robot joints and structures. The company explains that by integrating self-made ball screws, harmonic reducers, motors, drivers, and control technologies, it has created linear and rotary actuation modules that feature high power density, energy saving, miniaturization, and high reliability, demonstrating its key competitiveness in the humanoid robot field.