Innolux: Leveraging Display Technology to Accelerate Integration with Semiconductors and IoT
Innolux announced at its shareholders' meeting that it is accelerating the integration of display technology with semiconductors and IoT. Through its FOPLP 'Chip First' technology, the company is reducing costs and chip sizes, targeting automotive and AI server markets.
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- 📰 Published: May 27, 2026 at 15:42
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Central News Agency, Taipei, May 27. Panel manufacturer Innolux held its shareholders' meeting today. Chairman Jim Hung stated that display technology, as the core carrier of modern technology, is accelerating its integration with semiconductor and IoT technologies. Innolux is transitioning into advanced semiconductor packaging and testing, having achieved volume shipments last year with high customer satisfaction regarding both volume and yield.
Hung pointed out that while the global political and economic situation is undergoing a dramatic reshuffling and the high-interest-rate environment is gradually easing, the shifting geopolitical landscape, restructuring of trade barriers, and the technological explosion of generative AI moving from the cloud to edge devices have made this a year full of challenges and opportunities.
He noted that Taiwan possesses a leading advantage in semiconductors and advanced packaging. Innolux's 'Chip First' technology in Fan-Out Panel Level Packaging (FOPLP) can help customers reduce die size, significantly lower costs, and decrease overall package thickness, meeting the increasingly stringent thickness requirements for mobile devices and making it highly suitable for advanced packaging of communication chips.
Furthermore, the Chip First technology has evolved into thick copper wiring technology, suitable for chips requiring high voltage, high current, and high heat dissipation. Following the development of multi-die heterogeneous integration packaging technology, Innolux has gained approval from major automotive semiconductor manufacturers and power management clients for AI server SPS (Smart Power Stage) applications. These clients have designated Innolux to develop their latest third-generation semiconductor multi-die high-power power management ICs, with a series of product introduction plans already in place.
At the same time, Innolux's unique embedded packaging technology, which uses low dielectric constant (Dk) and low dissipation factor (Df) insulating materials, has attracted significant interest from international microwave chip clients. A series of design parameter verifications has begun to develop their next-generation microwave chips, covering not only automotive radar applications but also future gesture control chips.
Hung pointed out that while the global political and economic situation is undergoing a dramatic reshuffling and the high-interest-rate environment is gradually easing, the shifting geopolitical landscape, restructuring of trade barriers, and the technological explosion of generative AI moving from the cloud to edge devices have made this a year full of challenges and opportunities.
He noted that Taiwan possesses a leading advantage in semiconductors and advanced packaging. Innolux's 'Chip First' technology in Fan-Out Panel Level Packaging (FOPLP) can help customers reduce die size, significantly lower costs, and decrease overall package thickness, meeting the increasingly stringent thickness requirements for mobile devices and making it highly suitable for advanced packaging of communication chips.
Furthermore, the Chip First technology has evolved into thick copper wiring technology, suitable for chips requiring high voltage, high current, and high heat dissipation. Following the development of multi-die heterogeneous integration packaging technology, Innolux has gained approval from major automotive semiconductor manufacturers and power management clients for AI server SPS (Smart Power Stage) applications. These clients have designated Innolux to develop their latest third-generation semiconductor multi-die high-power power management ICs, with a series of product introduction plans already in place.
At the same time, Innolux's unique embedded packaging technology, which uses low dielectric constant (Dk) and low dissipation factor (Df) insulating materials, has attracted significant interest from international microwave chip clients. A series of design parameter verifications has begun to develop their next-generation microwave chips, covering not only automotive radar applications but also future gesture control chips.
FAQ
What is Innolux's future strategy?
Focusing on semiconductor packaging technology.