The Executive Committee has decided to hold the first "Next Generation Electronics Technology Exhibition," bringing together products and services such as SMT equipment, assembly-related materials and equipment, inspection and measurement, electronic components and materials, and semiconductor/sensor packaging technologies under one roof.

Background of the Event

AI, IoT, and decarbonization. As all industries undergo drastic transformations, the required role of the electronics industry is fundamentally changing. A new growth trajectory can no longer be drawn merely as an extension of traditional concepts like "miniaturization" and "cost reduction." What is needed is an open evolution that breaks out of closed development environments and cross-pollinates with unknown insights.

The Executive Committee is launching the first "Next Generation Electronics Technology Exhibition" as the frontline of business where "solutions" for breaking down departmental walls and creating new value will converge. By transcending boundaries and merging new technologies and trends, next-generation business opportunities are born. Through high-quality business matching at this exhibition, we will strongly back the elevation of the entire electronics industry and the creation of new value.

Event Overview

Name: Next Generation Electronics Technology Exhibition Dates: August 4 (Wed) - August 6 (Fri), 2027 Venue: Makuhari Messe Concurrent Events: Next Generation Manufacturing Technology Exhibition / Next Generation Mobility Technology Exhibition

Constituent Exhibitions and Target Exhibits

Next Generation Electronics Manufacturing & Assembly EXPO - SMT (Surface Mount Technology) related equipment, assembly line automation/labor-saving robots - Rework/repair equipment, soldering technology, EMS/contract manufacturing services - Clean rooms, anti-static/noise countermeasures, etc.

Next Generation Measurement & Analytics EXPO - AI visual inspection/image processing systems, non-destructive testing (X-ray, CT, etc.) - Testers / measurement, testing, and analytical instruments, yield improvement / predictive maintenance data analysis - Measurement data integration solutions, etc.

Next Generation Semiconductor & Sensor Packaging EXPO - 3D packaging / chiplet-related technologies, semiconductor/sensor/MEMS assembly equipment - Power module assembly technology, next-generation packaging materials and components - Advanced plating and etching technologies, etc.

Next Generation Materials & Electronic Components EXPO - Next-generation electronic components, high-frequency compatible / miniaturization compatible materials, printed circuit boards / board materials - High-performance materials, sustainable materials, advanced thermal management and heat dissipation technologies, etc.

Target Attendees Personnel from manufacturers of electronics, semiconductors, electronic components, and automobiles, in departments such as: - Manufacturing and Production Engineering - Quality Assurance and Quality Control - Design, Development, and Research - Procurement and Purchasing - DX and IT Promotion - Corporate Management and Corporate Planning ...and more.

About the Organizer The organizing committee has previously hosted numerous exhibitions, including the "DX Comprehensive EXPO," one of the largest comprehensive DX exhibitions in Japan. Thanks to your support, we have achieved 7 crowns in satisfaction surveys and 4 crowns in factual surveys by the Japan Marketing Research Organization.

Exhibitor Recruitment Now Open! <Booth locations can be selected on a first-come, first-served basis> We have started recruiting exhibitors for this exhibition. Booth locations can be chosen on a first-come, first-served basis. If you are interested in exhibiting, please contact us below.

Contact Information Next Generation Electronics Technology Exhibition Executive Committee 5th Floor, PMO Takanawa Gateway, 2-19-17 Takanawa, Minato-ku, Tokyo 108-0014 (Inside Everridge Inc.) TEL: 03-6632-2802 (Weekdays 10:00 - 18:00) e-mail: electronics-s@bizcrew.jp

FACT BOX

  • Source: PR TIMES
  • Category: Event