Anritsu and Qualcomm Collaborate to Demonstrate 3GPP Release 17 5G NR SA Uplink Data Compression Functionality

Anritsu Corporation (President: Koichi Hamada) has successfully verified test cases for 'Uplink Data Compression (UDC)' as defined in 3GPP RAN5 Release 17, in collaboration with Qualcomm Technologies, Inc. (Headquarters: USA, hereinafter 'Qualcomm Technologies'). The verification aims to improve efficiency of data transmission in uplink communications from mobile devices (UE: User Equipment) to 5G networks, enabling efficient implementation and evaluation of the latest UDC functionality in UEs.

The verification was conducted using Anritsu's 5G NR Mobile Test Platform ME7834NR to evaluate the UDC functionality of a UE equipped with the Qualcomm® X105 5G Modem-RF System. These test cases are defined in the 3GPP technical specification TS 38.523-1 and align with key requirements in TS 38.323. Anritsu submitted these test cases to 3GPP RAN5.

Development Background

With the expanding use of smartphones, mobile data traffic continues to grow, increasing network loads. In particular, due to increasingly frequent data transmissions and diversified services, technologies that enable efficient data transmission while maintaining communication quality are required even in uplink communications.

Traditionally, header compression technologies such as Robust Header Compression (ROHC) have been used in uplink communications to reduce overhead caused by IP headers and transport-layer headers added to communication data. In contrast, UDC introduced in 3GPP Release 17 compresses redundant data (such as duplicate data) before transmission, reducing redundancy across the entire transmitted data—not limited to headers—thereby decreasing the volume of data in uplink communications.

UDC compresses data on the UE side prior to transmission, reducing the volume of data sent to the network. This is expected to enable more effective use of limited frequency resources and improve data transfer efficiency in real-world communication environments. Through this collaboration, Anritsu and Qualcomm Technologies will support verification of UDC conformance and interoperability, accelerating the commercialization of UDC features compliant with 3GPP Release 17.

Daisaburo Yokoo, General Manager of the Mobile Solutions Business Unit at Anritsu Corporation, said: "Support for the UDC test cases in 3GPP Release 17 enables more efficient use of uplink radio resources by compressing redundant data. Through accurate verification of UDC functionality, we contribute to improving uplink throughput and network efficiency for mobile operators and device vendors. We are proud to have established a reliable and rapid environment for implementing and verifying new 5G features like UDC through this collaboration."

*Products under the Qualcomm® brand are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm® is a trademark or registered trademark of Qualcomm Incorporated.

Product Overview

The ME7834NR is registered with GCF (Global Certification Forum), the UE certification body, and PTCRB (PCS Type Certification Review Board), primarily in North America, as 5G NR Test Platform TP251. This test platform supports 3GPP-compliant Protocol Conformance Tests (PCT) and Carrier Acceptance Tests (CAT) for mobile devices incorporating multiple radio access technologies. It supports both Standalone and Non-Standalone modes of 5G NR, as well as LTE, LTE-Advanced, LTE-A Pro, W-CDMA, NTN, and UDC, which is the focus of this initiative. Additionally, when combined with Anritsu's OTA RF chamber MA8171A and RF converters, the platform enables 5G NR testing in both sub-6 GHz and millimeter wave bands.

For more information about the ME7834NR, visit the link below

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