AndTech to Hold WEB Online Zoom Seminar on "Overview of Semiconductor CMP Technology, Material Removal Mechanisms, Abrasive Grain Development, Slurry Dispersibility Evaluation Techniques, and Post-Cleaning Characteristics" on May 14th (Thursday)

AndTech Co., Ltd. (Headquarters: Kawasaki City, Kanagawa Prefecture, President: Masao Suyama, hereinafter referred to as AndTech) will offer a "Semiconductor CMP Technology" seminar, as part of its Zoom lecture series for R&D support. This seminar is designed to address the growing need for solutions to challenges in semiconductor CMP technology.

The seminar will cover an overview and characteristics of CMP and cleaning processes in semiconductor manufacturing, followed by explanations and introductions on "the relationship between the physical properties and functions of abrasive grains from the perspective of material/abrasive grain manufacturers, handling methods, and precautions," "research results visualizing slurry behavior at the contact interface during CMP processing using contact imaging analysis and in-situ observation techniques," and "evaluation of slurry dispersibility using zeta potential, wafer zeta potential measurement methods, and evaluation of electrostatic interactions."

This seminar is scheduled to commence on May 14th, 2026. Details: https://andtech.co.jp/seminars/1f11e98b-a593-63b4-b280-064fb9a95405

Live Streaming WEB Seminar Outline ────────────────── Theme: Overview of Semiconductor CMP Technology for Miniaturization and High Performance, Material Removal Mechanisms, Trends in Abrasive Grain Development and Slurry Dispersibility Evaluation Techniques, and Characteristics of Post-Cleaning Date and Time: Thursday, May 14th, 2026, 10:30 - 16:50 Participation Fee: 60,500 yen (tax included) *Materials will be distributed electronically. URL: https://andtech.co.jp/seminars/1f11e98b-a593-63b4-b280-064fb9a95405 WEB Streaming Format: Zoom (URL will be sent after registration)

Seminar Content Structure ──────────── ─ Program and Lecturers ─ ∽∽───────────────────────∽∽ Part 1: Overview of Chemical Mechanical Polishing (CMP) Technology in Semiconductor Manufacturing and Characteristics of Post-CMP Cleaning ∽∽───────────────────────∽∽ Lecturer: Masayoshi Imai, Technical Marketing Section, Equipment Business Division, Precision & Electronic Company, EBARA CORPORATION ∽∽───────────────────────∽∽ Part 2: Material Removal Mechanism in CMP - Understanding Based on Visualization of Auxiliary Materials (Pads and Slurry) ∽∽───────────────────────∽∽ Lecturer: Michio Umeda, Professor, Department of Mechanical Engineering, Faculty of Engineering, National University Corporation Tokai National Higher Education Organization, Gifu University ∽∽───────────────────────∽∽ Part 3: Characteristics of Silica-Based Particles and Their Application Technology in Semiconductor Polishing ∽∽───────────────────────∽∽ Lecturer: [Name and Affiliation missing from original text]