Foxconn Announces Key Issuance Terms for its 2026 2nd Series Unsecured Corporate Bonds

1. Board of Directors' Resolution Date: NA 2. Name (XX Company's Xth Series Secured/Unsecured Corporate Bonds): Hon Hai Precision Industry Co., Ltd. 2026 2nd Series Unsecured Corporate Bonds 3. Whether to Adopt a Shelf Registration for Issuance of Corporate Bonds (Yes/No): No 4. Total Issuance Amount: NT$16,100,000,000 5. Face Value Per Bond: NT$1,000,000 6. Issuance Price: Issued at 100% of par value 7. Issuance Period: 3-year, 5-year, and 10-year terms 8. Interest Rate: Fixed annual interest rate of 1.85% (3-year term), 1.87% (5-year term), and 1.92% (10-year term). 9. Type, Name, Amount of Collateral, and Agreed Matters: Not applicable 10. Use of Raised Funds and Utilization Plan: Repayment of short-term liabilities 11. Underwriting Method: Commissioned to securities underwriters to conduct public underwriting through negotiation 12. Trustee for Corporate Bonds: Mega International Commercial Bank Co., Ltd. 13. Underwriting or Consignment Institution: Taishin Securities Co., Ltd. as the lead underwriter 14. Guarantor: Not applicable 15. Agent for Redemption and Interest Payment: Mega International Commercial Bank Co., Ltd., Chengzong Branch 16. Certifying Institution: Not applicable 17. If convertible into shares, conversion method: Not applicable 18. Put option terms: Not applicable 19. Call option terms: Not applicable 20. If convertible, exchangeable, or exercisable for warrants, conversion basis date: Not applicable 21. If convertible, exchangeable, or exercisable for warrants, potential dilution of equity: Not applicable 22. Other Matters to be Notified: None