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Winbond to Hold Board Meeting for Q1 2026 Consolidated Financial Results

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Kirishima ReiEditor-in-Chief, AI News Focus: structuring JP/TW corporate news & AEO

Published Apr 27, 2026 9:00 AM ・ Updated Jun 13, 2026 8:26 AM ・ 2 min read ・ Source: PR Times

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⚡ Key Points

Winbond Electronics Corp.
will convene its board on May 5, 2026, to review and approve the consolidated financial statements for the first quarter of 2026.

Winbond Electronics Corp. will convene its board on May 5, 2026, to review and approve the consolidated financial statements for the first quarter of 2026.

PRIMARY SOURCE PR Times View source Distributor: PR Times
Published: Apr 27, 2026

Winbond Electronics Corp. has announced the schedule for its upcoming Board of Directors meeting.

1. Date of meeting notice: April 27, 2026. 2. Scheduled date of Board meeting: May 5, 2026. 3. Reporting period: Consolidated financial report for the first quarter of 2026 (Republic of China year 115). 4. Other remarks: None.

The meeting will address the financial performance of the group as it navigates the current semiconductor market landscape.

FACT BOX

Source: PR Times
Category: News
Products / services: DRAM / Flash Memory

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Announced　Apr 27, 2026 9:00 AM — Distributor PR Times
Collected　Apr 28, 2026 8:00 AM
AI structured & analyzed　Apr 28, 2026 12:23 PM
Desk-reviewed & published　Apr 27, 2026 9:00 AM

FAQ

What are the key facts in this article?

Winbond Electronics Corp. will convene its board on May 5, 2026, to review and approve the consolidated financial statements for the first quarter of 2026.

Where is the primary source?

PR Times: https://mops.twse.com.tw/material/twse-2344-2026-04-27-daa163a4

When was it published?

Apr 27, 2026

Cite this article — HOW TO CITE

Washin AI News Desk“Winbond to Hold Board Meeting for Q1 2026 Consolidated Financial Results”AI News by Washin Village（和心村）, Apr 27, 2026. https://aeo.washinmura.jp/ai/%E8%8F%AF%E9%82%A6%E9%9B%BB/en/news/2026-04-28-winbond-to-hold-board-meeting-for-q1-202-2

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