[ITEQ] Announcement by Important Subsidiary ITEQ (Hong Kong) Limited on Board Resolution Regarding Profit Distribution Plan
Key facts
- [ITEQ] Announcement by Important Subsidiary ITEQ (Hong Kong) Limited on Board Resolution Regarding Profit Distribution Plan
- ITEQ (Hong Kong) Limited, a key subsidiary of ITEQ Corporation, announced a cash dividend distribution of RMB 225,000,000 following a board resolution passed on June 22, 2026. No additional disclosures required.
- Source: PR Times
- Date: June 22, 2026
Direct answer
ITEQ (Hong Kong) Limited, a key subsidiary of ITEQ Corporation, announced a cash dividend distribution of RMB 225,000,000 following a board resolution passed on June 22, 2026. No additional disclosures required.
- Citation
- [ITEQ] Announcement by Important Subsidiary ITEQ (Hong Kong) Limited on Board Resolution Regarding Profit Distribution Plan (June 22, 2026), PR Times
- Source
- PR Times
- Date
- June 22, 2026
ITEQ (Hong Kong) Limited, a key subsidiary of ITEQ Corporation, announced a cash dividend distribution of RMB 225,000,000 following a board resolution passed on June 22, 2026. No additional disclosures required.
📋 Article Processing Timeline
- 📰 Published: June 22, 2026 at 09:00
- 🔍 Collected: June 23, 2026 at 17:00 (32h 0m after Published)
- 🤖 AI Analyzed: June 23, 2026 at 17:33 (33 min after Collected)
1. Date of Board Resolution: June 22, 2026
2. Type and Amount of Dividend Distribution: Cash dividend totaling RMB 225,000,000.
3. Other Matters to be Disclosed: None
2. Type and Amount of Dividend Distribution: Cash dividend totaling RMB 225,000,000.
3. Other Matters to be Disclosed: None
FAQ
What is the dividend amount announced by ITEQ (Hong Kong) Limited?
A total of RMB 225 million in cash dividends will be distributed.
Why is this dividend announcement significant?
It indicates the subsidiary's profitability and financial health, serving as a key investment reference.
What are ITEQ Corporation's main products?
Main products include high-frequency substrates, IC package substrates, and BT resin substrates, with strengths in 5G, AI, and EV applications.