The Chugoku Bank supports companies contributing to the regional community through the issuance of private placement bonds.

On Monday, June 15, we will underwrite Gophertec Co., Ltd.'s 3rd unsecured corporate bond (SDGs Private Placement Bond 'Regional Support'*) and act as its financial agent. A portion of the fees received for this service will be donated to the Okayama Prefecture Scholarship Foundation under the joint names of Gophertec and our bank.

*SDGs Private Placement Bond 'Regional Support': This is a private placement bond aimed at contributing to the local community in connection with the SDGs. A portion of the fees received from the issuing company is used to purchase supplies or make donations to an SDGs-related destination designated by the issuer, under the joint names of the bank and the issuing company.

[Overview of the Issuing Company and the Private Placement Bond]

Issue Name: Gophertec Co., Ltd. 3rd Unsecured Corporate Bond (with Chugoku Bank guarantee and restricted to qualified institutional investors) Location: 1-2-10 Tamachi, Kita-ku, Okayama City, Okayama Prefecture Representative: Masami Shoji Industry: Electronic Machinery Manufacturing Net Sales: 1,181 million yen (fiscal year ended November 2025 / Reiwa 7) Issue Amount: 100 million yen Issue Date: Monday, June 15, 2026 (Reiwa 8) Issue Period: 5 years Redemption Method: Bullet redemption at maturity Use of Funds: Working capital Donation Recipient: Okayama Prefecture Scholarship Foundation

Comment from the Issuer: Under our corporate philosophy of 'contributing to the creation of a rich and comfortable society by making full use of computer technology,' we have continuously challenged ourselves to advance technology through the development of electronic circuit products. We hope that this donation to the Okayama Prefecture Scholarship Foundation will help students who will lead the future.

The Chugoku Bank, Ltd. Telephone: 086-223-3111 Public Relations Center: Okajima (Extension 2255)

FACT BOX

  • Source: PR TIMES
  • Category: Funding