1. Date of Board of Directors' resolution: NA 2. Name (XX Company's Xth (secured/unsecured) corporate bonds): Taiwan Semiconductor Manufacturing Company Limited 2026 Second Unsecured Ordinary Corporate Bonds (Green Bonds) 3. Whether to adopt shelf registration for corporate bond issuance (Yes/No): No 4. Total issuance amount: The total issuance amount is NT$18.4 billion, divided into two types, Class A and Class B, depending on the issuance period. The issuance amount for Class A is NT$13.7 billion, and for Class B is NT$4.7 billion. 5. Face value per bond: NT$10 million 6. Issue price: Issued at full face value 7. Issuance period: Class A has an issuance period of 5 years, and Class B has an issuance period of 10 years. 8. Issuance interest rate: Class A fixed annual interest rate of 1.80%, Class B fixed annual interest rate of 1.85%. 9. Type, name, amount, and agreed matters of collateral: None 10. Purpose and utilization plan of funds raised: Expenditures related to green buildings and green environmental protection. 11. Underwriting method: Public underwriting by a securities underwriter through negotiated sales. 12. Corporate bond trustee: Taipei Fubon Commercial Bank Co., Ltd. 13. Underwriting or selling agency: KGI Securities Co., Ltd. is appointed as the lead underwriter. 14. Issuing guarantor: None 15. Agency for principal and interest repayment: Taipei Fubon Commercial Bank Co., Ltd., City Hall Branch. 16. Certifying institution: None 17. Conversion method for convertible bonds: Not applicable 18. Put options: None 19. Call options: None 20. Record date for conversion, exchange, or subscription rights: Not applicable 21. Potential dilution of equity due to conversion, exchange, or subscription rights: Not applicable 22. Other matters that should be stated: The company's board of directors passed the resolution to raise unsecured ordinary corporate bonds on 2025/8/12 and 2026/2/10. This is an explanation after the pricing of the 2026 second phase corporate bonds (green bonds) was completed.

FACT BOX

  • Source: PR Times
  • Category: Funding