Mounting Technology Evolving in the xEV/SDV Era: Senju Metal Industry Deploys 'Process Proposal Exhibition' at JISSO PROTEC

Against the backdrop of the expansion of xEV/SDV, AI servers, and power semiconductors, the environment surrounding electronics mounting is undergoing significant change. In addition to responding to higher density and heat dissipation, mounting sites are required to simultaneously achieve thermal management, quality, productivity, and environmental friendliness amid soaring material prices, labor shortages, and increasingly sophisticated quality demands.

In this context, Senju Metal Industry Co., Ltd. (Headquarters: Adachi-ku, Tokyo; President and Representative Director: Ryoichi Suzuki), which develops joining solutions centered on solder materials, will deploy a 'Process Proposal Exhibition' combining equipment, materials, and processes at 'JISSO PROTEC 2026,' held at Tokyo Big Sight for three days from Wednesday, June 10 to Friday, June 12, 2026.

At this exhibition, the company will also premiere the final installment of its first documentary video project, the 'Frontline Series.' Furthermore, on Friday, June 12, the company will present a seminar at the PROTEC Seminar on the theme of 'Mounting Trends in the Power Semiconductor Field.'

An era where neither 'equipment nor materials' alone can provide solutions – A 'Process Proposal Exhibition' focusing on the entire mounting process

In recent mounting sites, with the increase in devices with large thermal capacity and higher density, cases where simply selecting materials or equipment individually is insufficient are increasing.

At this exhibition, under the theme 'Implementing the potential of manufacturing into future society,' the company will propose mounting as a 'process' that combines materials, equipment, and conditions.

The booth will be structured so that visitors can concretely grasp application images and consideration points for introduction by comparing them with their own processes and challenges through actual equipment, model displays, and presentations.

The company will also introduce the comprehensive technologies of the SMIC Group, including environmentally friendly solder materials, the low-temperature solder solution 'MILATERA,' and analysis technologies related to mounting.

*The image is an illustration. The design may be subject to change.

Why our company confronts 'mounting' – Premiere of the final installment of the documentary video 'Frontline Series'

At the venue, the company will premiere the third installment of the documentary video 'Frontline Series,' titled 'The Frontline of "Mounting Technology" Realizing Manufacturing,' which depicts how employees from various departments such as development, manufacturing, and sales confront mounting challenges.

This series is the company's first video project, planned to convey through 'solder,' a material invisible in finished products, what kind of people and with what feelings they are engaging with customers and society.

Previously, the first installment, 'The Frontline of "Solder" Supporting Automotive Safety,' was released exclusively at the Nagoya Car Electronics Exhibition in October 2025, and the second installment, 'The Frontline of "Material Technology" Connecting the World,' was released at the Tokyo Car Electronics Exhibition in January 2026. Visitors commented that 'the image of a materials manufacturer has changed' and 'you can see the engineers' thinking,' garnering high attention within the booth.

The third and final installment depicts employees from different positions such as sales, development, and manufacturing confronting 'mounting' from their respective perspectives.

This video is scheduled to be released on the company's website after the exhibition.

*The image shows some scenes from the third installment, filmed in Miyagi, Tochigi, Saitama, and Hyogo prefectures.

Presentation at PROTEC Seminar on Power Semiconductor Mounting

On Friday, June 12, at the 'PROTEC Seminar,' Ms. Megumi Hayakawa, a researcher at the company's Research and Development Headquarters, will take the stage. The lecture will focus on power semiconductors, whose demand is expanding in the xEV/SDV and renewable energy fields, explaining technological trends required for next-generation mounting, such as high-temperature environment compatibility, high-current compatibility, and thermal management.

Furthermore, from the standpoint of handling both solder materials and FA equipment, the lecture will introduce 'optimization of the entire mounting process,' including not only joining materials but also equipment-side technologies such as heating profile control and atmosphere control.

Additionally, as a new approach through collaborative design of materials and equipment, joining technology in a formic acid reduction atmosphere will also be explained.

■Exhibition Overview

◎Name: 27th Mounting Process Technology Exhibition (JISSO PROTEC 2026)

◎Period: Wednesday, June 10 – Friday, June 12, 2026, 10:00 – 17:00

◎Venue: Tokyo Big Sight (3-11-1 Ariake, Koto-ku, Tokyo)

◎Exhibition Hall: East Exhibition Hall 1F

◎Booth Number: 1B-49

▶Official Website: https://www.jissoprotec.jp/

▶Visitor Registration (Invitation Ticket): https://f-vr.jp/jpca/enq/mail_reg/jpca2026/event_reg_form.cgi

■Seminar Overview

Mounting Technology Trends in the Power Semiconductor Field

◎Speaker: Ms. Megumi Hayakawa, Researcher, Solder Technical Center, Research and Development Headquarters

◎Date & Time: Friday, June 12, 2026, 15:15 – 16:00

◎Venue: PROTEC Seminar Venue

Capacity is 120 people. Please come to the seminar venue on the day. Registration will be on a first-come, first-served basis.

▶Detailed Information: https://jpca2026.tems-system.com/eguide/jp/sem/protec/seminar_details/WSalbSt-vIY#A29157315

■Company Overview

Company Name: Senju Metal Industry Co., Ltd.

Headquarters Address: 23 Senju Hashidocho, Adachi-ku, Tokyo 120-8555

President and Representative Director: Ryoichi Suzuki

Established: April 15, 1938

Capital: 430 million yen

Website: https://www.senju.com

■Contact for Inquiries

Senju Metal Industry Co., Ltd. Public Relations Department

E-mail: web@senju.com