TPK-KY: Entering Semiconductor Advanced Packaging with TGV Core Technology
Touch panel manufacturer TPK-KY announced its entry into the semiconductor advanced packaging field, developing TGV (Through Glass Via) glass substrate technology for high-performance computing and AI chips. This technology offers superior thermal stability and high-frequency electrical properties compared to traditional organic materials, enhancing signal transmission quality. A trial production line for TGV advanced packaging glass substrates is expected to be completed in Taiwan by July 2026, with sample shipments and verification to follow.
📋 Article Processing Timeline
- 📰 Published: April 8, 2026 at 17:07
- 🔍 Collected: April 8, 2026 at 18:00 (53 min after Published)
- 🤖 AI Analyzed: April 15, 2026 at 20:53 (170h 52m after Collected)
Touch panel manufacturer TPK-KY (宸鴻) was invited to participate in the opening event of the 2026 Touch Taiwan Innovation Technology Exhibition today.
TPK-KY explained that with the rapid development of artificial intelligence (AI) applications, the demand for chip computing density and data processing continues to increase. Semiconductor packaging architectures are accelerating towards large-size, multi-chip integration. Existing traditional organic material substrates used for semiconductor packaging are gradually facing performance bottlenecks and supply chain limitations. Glass substrates using TGV technology will have excellent thermal stability, which can effectively improve the warpage problem of large-size substrates.
At the same time, glass materials also perform better than traditional organic materials in high-frequency electrical properties, which can significantly improve signal transmission quality and are regarded as a breakthrough key technology for next-generation high-performance computing (HPC) and AI chip packaging.
Regarding next-generation high-speed data transmission key technologies, silicon photonics (SiPh, Silicon Photonics) and co-packaged optics (CPO, Co-Packaged Optics), TPK-KY stated that TGV glass substrates, with their advantages of high frequency and low loss, can greatly shorten the signal path, becoming a breakthrough solution for extreme bandwidth and low power consumption. Through this advanced architecture, transmission power consumption can be reduced by 70%, and signal loss can be reduced by more than 80%.
This architecture is a key cornerstone for promoting the global total bandwidth towards ultra-large-scale switches above 100T, providing extreme power efficiency for next-generation AI computing facilities.
TPK-KY stated that the core key of the TGV process lies in precision glass processing and stress control capabilities. With long-term deep cultivation in glass touch technology and rich experience accumulated in ultra-thin glass processing and self-assembled customized automatic equipment, it has established the ability to precisely control glass perforation and stress distribution in multi-stage processes, which can effectively suppress micro-cracks and lay a solid technical foundation for large-size advanced packaging.
To accelerate technology development and commercial mass production progress, TPK-KY pointed out that its Taiwan factory has invested in building a dedicated TGV advanced packaging glass substrate trial production line, covering semiconductor-grade precision laser, etching, electroplating processes, and high-end testing systems and other advanced equipment. The equipment has been installed one after another, and the preliminary plan is that the trial production line will be completed by July 2026, and sample delivery and verification will be initiated. In the future, TPK-KY will continue to deepen its TGV technology layout and actively enter the semiconductor advanced packaging supply chain, injecting new business momentum for long-term development. (Editor: Chang Chun-mao) 1150408
TPK-KY explained that with the rapid development of artificial intelligence (AI) applications, the demand for chip computing density and data processing continues to increase. Semiconductor packaging architectures are accelerating towards large-size, multi-chip integration. Existing traditional organic material substrates used for semiconductor packaging are gradually facing performance bottlenecks and supply chain limitations. Glass substrates using TGV technology will have excellent thermal stability, which can effectively improve the warpage problem of large-size substrates.
At the same time, glass materials also perform better than traditional organic materials in high-frequency electrical properties, which can significantly improve signal transmission quality and are regarded as a breakthrough key technology for next-generation high-performance computing (HPC) and AI chip packaging.
Regarding next-generation high-speed data transmission key technologies, silicon photonics (SiPh, Silicon Photonics) and co-packaged optics (CPO, Co-Packaged Optics), TPK-KY stated that TGV glass substrates, with their advantages of high frequency and low loss, can greatly shorten the signal path, becoming a breakthrough solution for extreme bandwidth and low power consumption. Through this advanced architecture, transmission power consumption can be reduced by 70%, and signal loss can be reduced by more than 80%.
This architecture is a key cornerstone for promoting the global total bandwidth towards ultra-large-scale switches above 100T, providing extreme power efficiency for next-generation AI computing facilities.
TPK-KY stated that the core key of the TGV process lies in precision glass processing and stress control capabilities. With long-term deep cultivation in glass touch technology and rich experience accumulated in ultra-thin glass processing and self-assembled customized automatic equipment, it has established the ability to precisely control glass perforation and stress distribution in multi-stage processes, which can effectively suppress micro-cracks and lay a solid technical foundation for large-size advanced packaging.
To accelerate technology development and commercial mass production progress, TPK-KY pointed out that its Taiwan factory has invested in building a dedicated TGV advanced packaging glass substrate trial production line, covering semiconductor-grade precision laser, etching, electroplating processes, and high-end testing systems and other advanced equipment. The equipment has been installed one after another, and the preliminary plan is that the trial production line will be completed by July 2026, and sample delivery and verification will be initiated. In the future, TPK-KY will continue to deepen its TGV technology layout and actively enter the semiconductor advanced packaging supply chain, injecting new business momentum for long-term development. (Editor: Chang Chun-mao) 1150408
FAQ
What new technology is TPK-KY developing?
TPK-KY is developing TGV (Through Glass Via) glass substrate technology for semiconductor advanced packaging.
When is the trial production line expected to be completed?
The trial production line in Taiwan is expected to be completed by July 2026, with sample shipments and verification to begin.