Smart Display Exhibition: Merck Promotes Innovative Photoresist Technology
Merck showcased innovative liquid crystal display materials, photoresist technology, and integrated solutions for advanced packaging at the Smart Display Exhibition. The company applies Chemical Amplified Resist (CAR) to Redistribution Layer (RDL) processes and high-selectivity CMP slurry to Through-Glass Via (TGV) processes, contributing to chip miniaturization and improved manufacturing quality. Merck also offers high-performance, low-power liquid crystal solutions for automotive applications, addressing the evolving needs of AI and semiconductor technologies.
📋 Article Processing Timeline
- 📰 Published: April 9, 2026 at 23:10
- 🔍 Collected: April 10, 2026 at 00:00 (50 min after Published)
- 🤖 AI Analyzed: April 15, 2026 at 19:37 (139h 37m after Collected)
Merck stated that its participation in this exhibition is based on its position at the intersection of display, optical, and semiconductor technologies. Merck is showcasing innovative liquid crystal display materials, photoresist technology, and integrated measurement and inspection solutions for advanced packaging, demonstrating its continuous key role in driving industrial upgrading and innovation.
Lee Yung-Li, General Manager of Merck Electronic Technology Business Group, Taiwan Optoelectronics, stated that the company continues to support the industry's accelerated transformation and technological upgrading, committing to strengthening the leading position and resilience of Taiwan's electronics industry in the international supply chain.
In response to advanced packaging and heterogeneous integration becoming key drivers for the evolution of AI and semiconductor technologies, Merck pointed out that its integrated material intelligence and measurement and inspection equipment solutions address panel-level packaging (PLP), through-glass via (TGV), and high-precision inspection demands, assisting the industry in responding to transformation and technological improvement challenges.
In the field of precision panel-level packaging, Merck utilizes its industry-leading Chemical Amplified Resist (CAR) in Redistribution Layer (RDL) processes to promote chip miniaturization. Simultaneously, through thick film photoresist, it forms copper pillars to replace solder, improving chip conductivity and heat dissipation efficiency.
For TGV processes, Merck provides high-selectivity CMP slurry, which can quickly remove excess copper layers while retaining titanium layers and glass substrates, reducing environmental burden and improving process quality and reliability.
As display technology continues to develop towards high efficiency, low power consumption, and diverse field applications, Merck is showcasing multiple innovative achievements in liquid crystal materials, focusing on "high-speed response," "high transmittance," and "high reliability," comprehensively responding to the current demands of display technology in performance, image quality, and application scenarios.
In automotive applications, Merck's liquid crystal solutions, combined with Fringe Field Switching (FFS) technology, optimize contrast and dark state performance. While enhancing automotive display quality, they can also cope with daily use in multiple extreme environments. (Edited by Yang Lan-Hsuan) 1150409
Lee Yung-Li, General Manager of Merck Electronic Technology Business Group, Taiwan Optoelectronics, stated that the company continues to support the industry's accelerated transformation and technological upgrading, committing to strengthening the leading position and resilience of Taiwan's electronics industry in the international supply chain.
In response to advanced packaging and heterogeneous integration becoming key drivers for the evolution of AI and semiconductor technologies, Merck pointed out that its integrated material intelligence and measurement and inspection equipment solutions address panel-level packaging (PLP), through-glass via (TGV), and high-precision inspection demands, assisting the industry in responding to transformation and technological improvement challenges.
In the field of precision panel-level packaging, Merck utilizes its industry-leading Chemical Amplified Resist (CAR) in Redistribution Layer (RDL) processes to promote chip miniaturization. Simultaneously, through thick film photoresist, it forms copper pillars to replace solder, improving chip conductivity and heat dissipation efficiency.
For TGV processes, Merck provides high-selectivity CMP slurry, which can quickly remove excess copper layers while retaining titanium layers and glass substrates, reducing environmental burden and improving process quality and reliability.
As display technology continues to develop towards high efficiency, low power consumption, and diverse field applications, Merck is showcasing multiple innovative achievements in liquid crystal materials, focusing on "high-speed response," "high transmittance," and "high reliability," comprehensively responding to the current demands of display technology in performance, image quality, and application scenarios.
In automotive applications, Merck's liquid crystal solutions, combined with Fringe Field Switching (FFS) technology, optimize contrast and dark state performance. While enhancing automotive display quality, they can also cope with daily use in multiple extreme environments. (Edited by Yang Lan-Hsuan) 1150409