Honjin's March Revenue Reaches New High, Driven by AI and CPO for Quarterly Growth
Honjin's March revenue hit a record NT$4.29 billion, up 38.52% month-on-month and 111.27% year-on-year. First-quarter revenue totaled NT$10.73 billion, an 81.1% increase. This growth is primarily due to cloud service providers' AI infrastructure upgrades, boosting demand for advanced packaging, CPO, low-earth orbit satellite communication, and various testing equipment. Honjin plans to invest NT$850 million to expand its Taichung plant.
📋 Article Processing Timeline
- 📰 Published: April 8, 2026 at 20:00
- 🔍 Collected: April 8, 2026 at 21:00 (1h 0m after Published)
- 🤖 AI Analyzed: April 15, 2026 at 20:55 (167h 55m after Collected)
Honjin's March revenue reached NT$4.29 billion, a month-on-month increase of 38.52% and a year-on-year increase of 111.27%; cumulative first-quarter revenue was NT$10.73 billion, an 81.1% increase compared to the same period last year.
Honjin pointed out that recent revenue and order growth primarily benefited from cloud service providers continuously advancing artificial intelligence (AI) infrastructure upgrades, which also drove the synchronous growth of demand for various high-end applications, further boosting demand for advanced packaging.
In terms of CPO (Co-Packaged Optics), Honjin stated that it has shipped hundreds of active thermal control test machines for ASIC (Application-Specific Integrated Circuit) switch chips, with order demand continuing to increase in 2026.
Honjin noted that it is collaborating with test equipment manufacturers Advantest and Teradyne to develop optoelectronic co-testing finished product test machines, which are expected to complete pre-mass production verification machine preparations in the fourth quarter.
Regarding low-earth orbit satellite communication, Honjin stated that customers continue to advance deployment, driving stable growth in demand for test equipment. In addition, Wafer-level Multi-Chip Module (WMCM) packaging began shipping in the first half of this year, with orders continuously increasing.
Honjin indicated that it has secured orders for Tensor Processing Unit (TPU) finished product testing and system-level testing equipment, with shipments expected to commence in the second and third quarters. Language Processing Unit (LPU) front-end chips are produced in a Korean factory, and the back-end uses Honjin's finished product active thermal control sorting machine test solution, for which orders have been secured, with shipments to Korea expected in the second and third quarters.
Honjin stated that it continues to receive orders from Central Processing Unit (CPU) and Graphics Processing Unit (GPU) customers, with large-scale shipments expected in the second and third quarters.
In response to the growth in AI-related application orders, Honjin stated that it will continue to initiate expansion of existing factories and lease and expand surrounding factories. With the approval of the Taichung City Government's factory立体化 (vertical expansion) plan, it will invest approximately NT$850 million in Taichung to build new factories. (Edited by Yang Lan-hsuan) 1150408
Honjin pointed out that recent revenue and order growth primarily benefited from cloud service providers continuously advancing artificial intelligence (AI) infrastructure upgrades, which also drove the synchronous growth of demand for various high-end applications, further boosting demand for advanced packaging.
In terms of CPO (Co-Packaged Optics), Honjin stated that it has shipped hundreds of active thermal control test machines for ASIC (Application-Specific Integrated Circuit) switch chips, with order demand continuing to increase in 2026.
Honjin noted that it is collaborating with test equipment manufacturers Advantest and Teradyne to develop optoelectronic co-testing finished product test machines, which are expected to complete pre-mass production verification machine preparations in the fourth quarter.
Regarding low-earth orbit satellite communication, Honjin stated that customers continue to advance deployment, driving stable growth in demand for test equipment. In addition, Wafer-level Multi-Chip Module (WMCM) packaging began shipping in the first half of this year, with orders continuously increasing.
Honjin indicated that it has secured orders for Tensor Processing Unit (TPU) finished product testing and system-level testing equipment, with shipments expected to commence in the second and third quarters. Language Processing Unit (LPU) front-end chips are produced in a Korean factory, and the back-end uses Honjin's finished product active thermal control sorting machine test solution, for which orders have been secured, with shipments to Korea expected in the second and third quarters.
Honjin stated that it continues to receive orders from Central Processing Unit (CPU) and Graphics Processing Unit (GPU) customers, with large-scale shipments expected in the second and third quarters.
In response to the growth in AI-related application orders, Honjin stated that it will continue to initiate expansion of existing factories and lease and expand surrounding factories. With the approval of the Taichung City Government's factory立体化 (vertical expansion) plan, it will invest approximately NT$850 million in Taichung to build new factories. (Edited by Yang Lan-hsuan) 1150408