ZEISS Unveils New 'Crossbeam 750' FIB-SEM: High-Efficiency TEM Lamella Prep via Live SEM Imaging and High-Resolution Observation with Gemini 4 Optics
ZEISS has announced the launch of the Crossbeam 750, a new FIB-SEM designed for high-precision sample preparation. Featuring the newly developed Gemini 4 electron optics and enhanced Live SEM Imaging, it allows for real-time high-resolution observation without interrupting FIB processing, drastically improving the success rate of TEM sample preparation in semiconductor analysis.
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Carl Zeiss Co., Ltd. (Chiyoda-ku, Tokyo; President: Vincent Mathieu) has announced the global launch of the ZEISS Crossbeam 750 on March 31, a new Focused Ion Beam Scanning Electron Microscope (FIB-SEM) optimized for high-precision sample preparation, and has begun full-scale promotion in Japan.
The new Crossbeam 750 features advanced Live SEM Imaging and the newly developed Gemini 4 electron optics. This enables extremely clear, real-time observation without halting the Focused Ion Beam (FIB) processing. This significantly enhances the success rate of Transmission Electron Microscope (TEM) sample preparation for analyzing cutting-edge semiconductor devices and brings dramatic efficiency to workflows from R&D to inspection in fields ranging from materials science to life sciences.
## ZEISS Crossbeam 750 Highlights
- Advanced Live SEM Imaging: Creates TEM thin-film samples by allowing clear SEM observation in real-time without interrupting FIB processing.
- New ZEISS Gemini 4 Electron Optics: Significantly improves resolution and S/N ratio at low accelerating voltages.
- High-Precision Predictable Endpoint Control: Ensures reliable retention of critical structures and provides a trustworthy, reproducible workflow.
(Figure 1: The new ZEISS Crossbeam 750, advancing Live SEM Imaging to 'observe while milling.')
## A Next-Generation FIB-SEM Born from the Philosophy of 'Never Stop Milling'
'The new ZEISS Crossbeam 750 was designed based on the fundamental principle that customers should not have to stop FIB milling to check the location within the sample,' says Thomas Rogers, Senior Director of Global Market Strategy and Head of Electronics Business Sector. 'The new High Dynamic Range (HDR) Mill+SEM function maintains clear, high-resolution SEM images under all FIB conditions—from high-speed milling with high FIB currents to precision polishing at 0.5 kV. This real-time clarity, combined with Gemini 4 optics, allows customers to fine-tune the process during milling, enabling high-uniformity TEM lamella preparation even on the first attempt. This reduces re-work and improves yield.'
The updated Gemini 4 electron optics achieve real-time endpoint settings without background noise and sub-nanometer precision in processing control, facilitating TEM lamella preparation and accurate 3D analysis. This meets the demands for analyzing logic and memory devices at cutting-edge nodes, as well as nanofabrication and 3D volume imaging.
The new Crossbeam 750 features advanced Live SEM Imaging and the newly developed Gemini 4 electron optics. This enables extremely clear, real-time observation without halting the Focused Ion Beam (FIB) processing. This significantly enhances the success rate of Transmission Electron Microscope (TEM) sample preparation for analyzing cutting-edge semiconductor devices and brings dramatic efficiency to workflows from R&D to inspection in fields ranging from materials science to life sciences.
## ZEISS Crossbeam 750 Highlights
- Advanced Live SEM Imaging: Creates TEM thin-film samples by allowing clear SEM observation in real-time without interrupting FIB processing.
- New ZEISS Gemini 4 Electron Optics: Significantly improves resolution and S/N ratio at low accelerating voltages.
- High-Precision Predictable Endpoint Control: Ensures reliable retention of critical structures and provides a trustworthy, reproducible workflow.
(Figure 1: The new ZEISS Crossbeam 750, advancing Live SEM Imaging to 'observe while milling.')
## A Next-Generation FIB-SEM Born from the Philosophy of 'Never Stop Milling'
'The new ZEISS Crossbeam 750 was designed based on the fundamental principle that customers should not have to stop FIB milling to check the location within the sample,' says Thomas Rogers, Senior Director of Global Market Strategy and Head of Electronics Business Sector. 'The new High Dynamic Range (HDR) Mill+SEM function maintains clear, high-resolution SEM images under all FIB conditions—from high-speed milling with high FIB currents to precision polishing at 0.5 kV. This real-time clarity, combined with Gemini 4 optics, allows customers to fine-tune the process during milling, enabling high-uniformity TEM lamella preparation even on the first attempt. This reduces re-work and improves yield.'
The updated Gemini 4 electron optics achieve real-time endpoint settings without background noise and sub-nanometer precision in processing control, facilitating TEM lamella preparation and accurate 3D analysis. This meets the demands for analyzing logic and memory devices at cutting-edge nodes, as well as nanofabrication and 3D volume imaging.