Valeo and Calyos Innovate Thermal Management for Data Center and Mobility Chips with Advanced Passive Two-Phase Cooling Solution

Key facts

  • Valeo and Calyos Innovate Thermal Management for Data Center and Mobility Chips with Advanced Passive Two-Phase Cooling Solution
  • Valeo and Calyos have partnered to develop a passive two-phase cooling solution that will revolutionize thermal management for chips in data centers and mobility. This technology addresses the heat challenges posed by AI and electrification, enabling efficient and reliable cooling.
  • Source: PR Times
  • Date: June 12, 2026

Direct answer

Valeo and Calyos have partnered to develop a passive two-phase cooling solution that will revolutionize thermal management for chips in data centers and mobility. This technology addresses the heat challenges posed by AI and electrification, enabling efficient and reliable cooling.

Citation
Valeo and Calyos Innovate Thermal Management for Data Center and Mobility Chips with Advanced Passive Two-Phase Cooling Solution (June 12, 2026), PR Times
Source
PR Times
Date
June 12, 2026
Valeo and Calyos have partnered to develop a passive two-phase cooling solution that will revolutionize thermal management for chips in data centers and mobility. This technology addresses the heat challenges posed by AI and electrification, enabling efficient and reliable cooling.

📋 Article Processing Timeline

  • 📰 Published: June 12, 2026 at 19:11
  • 🔍 Collected: June 12, 2026 at 10:21
  • 🤖 AI Analyzed: June 12, 2026 at 16:52 (6h 31m after Collected)
Valeo, a global leader in automotive technology, and Calyos, a pioneer in passive advanced two-phase Loop Heat Pipe (LHP) cooling solutions, have announced the signing of a Memorandum of Understanding (MoU). This aims to develop and industrialize high-performance, standalone chip cooling solutions for mobility and computing, addressing the increasing thermal management challenges driven by electrification and Artificial Intelligence (AI).

By combining Calyos' expertise in Loop Heat Pipe technology with Valeo's world-class thermal system engineering, manufacturing scale, and global footprint, the two partners will deliver a new generation of passive advanced two-phase cooling systems that manage high heat flux more efficiently, are more compact, easier to integrate, and offer extreme reliability with no maintenance.

Addressing the Future of Mobility

As automotive electrification continues to scale and Software-Defined Vehicles (SDVs) advance, the computing power and heat generated by power electronics are increasing exponentially.

Valeo and Calyos' passive two-phase cooling solution offers the following benefits:

Power Electronics: Autonomous cooling for On-Board Chargers (OBCs), inverters, and "x-in-1" integrated power electronics, providing a compact, standalone, "plug-and-play" cooling system. For electronics located in the rear of the vehicle, this solution brings energy savings and simplification of the vehicle's cooling architecture.

Software-Defined Vehicles (SDVs): SDV architectures drive the centralization of computing controllers with high power density requirements. The companies' solution enables standalone, compact, and reliable heat dissipation optimized for high-speed processors, ensuring reliability and ease of integration without the complexity of traditional distributed vehicle liquid cooling loops.

Innovating Cooling Efficiency and AI Scalability for Data Centers

Valeo leverages its decades of expertise in automotive thermal management to offer a comprehensive and scalable ecosystem of cooling solutions for the data center industry.

This collaboration targets the rapidly growing data center market beyond mobility. AI acceleration is driving up power in data center racks and chips, and the demand for direct-to-chip liquid cooling, along with the urgent need for better cooling efficiency to reduce global energy consumption (PUE - Power Usage Effectiveness), are critical.

One of the companies' first joint solutions, a smart two-phase passive chip cooling solution for data centers, will offer:

Energy Efficiency: Addresses higher processor power and heat flux requirements through the two-phase Loop Heat Pipe effect, operating without any driven components like pumps.

Ease of Retrofit for Air-Cooled Servers: Standalone two-phase Loop Heat Pipe air-cooling units can be installed per individual server in a rack, allowing data centers to upgrade power density with direct-to-chip cooling without overhauling their entire facility infrastructure.

Reliability and Compactness: A passive and highly efficient two-phase cooling system that simplifies maintenance (no driven fluid pump) and reduces the risk of leaks compared to traditional water-cooling methods (low dielectric fluid pressure).

Xavier Dupont, CEO of Valeo’s Power Division, stated: "This collaboration with Calyos is another step in our mission to lead the thermal management revolution. By integrating Calyos' Loop Heat Pipe expertise into Valeo's manufacturing ecosystem, we will offer customers in both automotive and data center sectors a unique cooling solution that is easy to integrate and scale, and significantly improves energy efficiency to support a more sustainable future. This new technology perfectly complements our existing portfolio of thermal management solutions for data centers and vehicle power electronics."

Antoine DE RYCKEL, CEO of CALYOS, and Olivier DE LAET, Founder of CALYOS, added: "Partnering with Valeo allows us to elevate our technology from niche innovation to a global industrial standard. Valeo's manufacturing capabilities and thermal management expertise are the perfect catalyst to meet the cooling demands of the AI era and next-generation electric vehicles."

Becoming a Key Player in Global Industry

Through this agreement, Calyos' innovative technology will benefit from Valeo's excellent production capabilities. Valeo will ensure excellent system reliability and mass production capacity. With its "Local for Local" manufacturing strategy, Valeo will be able to produce these advanced cooling systems and provide supply chain autonomy worldwide.

This new technology complements our current product range, including Rear Door Heat Exchanger cooling modules (RDHx), single and two-phase cooling distribution units (CDUs), and immersion cooling for edge data centers, acting as a smart add-on to our existing portfolio of data center liquid cooling solutions.

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What are the key facts in this article?

Valeo and Calyos have partnered to develop a passive two-phase cooling solution that will revolutionize thermal management for chips in data centers and mobility. This technology addresses the heat challenges posed by AI and electrification, enabling efficient and reliable cooling.

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Valeo and Calyos have partnered to develop a passive two-phase cooling solution that will revolutionize thermal management for chips in data centers and mobility. This technology addresses the heat challenges posed by AI and electrification, enabling efficient and reliable cooling.

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PR Times: https://prtimes.jp/main/html/rd/p/000000228.000004446.html | June 12, 2026