New Comprehensive Analysis Service Launched to Help Reduce Defects in Semiconductor Encapsulants

Toray Research Center, in collaboration with Sanyu Rec, has launched a new service to comprehensively analyze the curing process of thermosetting resins like epoxy from the molecular level, aiming to reduce defects such as warping and cracking in semiconductor encapsulants.
New Service AnnouncementNQ 96/100出典：PR Times

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  • 📰 Published: May 20, 2026 at 20:10
  • 🔍 Collected: May 20, 2026 at 11:31
  • 🤖 AI Analyzed: May 22, 2026 at 12:20 (48h 48m after Collected)
Toray Research Center, Inc. (TRC), in collaboration with Sanyu Rec Co., Ltd., has developed and launched a new analysis service that comprehensively examines the curing process of thermosetting resins, such as epoxy, from the molecular level to overall material properties. This service can capture the progress of the curing reaction, changes in material properties, and the state of the interface between the resin and the fillers added to the encapsulant. This enables a holistic analysis of the curing phenomenon, which was often understood in separate parts, contributing to clarifying the causes of warping and cracking in semiconductor encapsulants, advancing material design, and optimizing manufacturing processes.

FAQ

What is the new service announced by Toray Research Center?

It is a comprehensive analysis and assessment service, developed with Sanyu Rec, that examines the entire curing process of thermosetting resins like epoxy, from the molecular level to overall material properties.

What specific problems does this service aim to solve?

The service aims to identify the causes of defects in semiconductor encapsulants, such as warping and cracking, which are influenced by the resin's curing behavior, thereby helping to reduce these issues.

How does this new analysis method work?

It combines advanced analytical techniques like Fast Scanning Calorimetry (FSC) and mass spectrometry with Molecular Dynamics (MD) simulations to holistically understand the curing reaction, molecular structure changes, and the resin-filler interface.

What is the main advantage of this service over traditional methods?

Its main advantage is the ability to analyze the curing phenomenon as an interconnected system (reaction, structure, interface), rather than as separate parts, moving beyond reliance on empirical knowledge for material design and process optimization.

What are the expected applications and benefits of this service?

It is expected to be used for improving the reliability of semiconductor packaging materials, advanced material design considering filler-resin combinations, optimizing molding conditions, and enabling more efficient material development.

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