[Semiconductor Back-end Process] Adoption of "Paper-based TPS Cleaning Sheet" for Semiconductor Encapsulation Mold Cleaning – Developed through Industry-Academia-Government Collaboration, Now in Use on Actual Production Lines

Tohoku Butsuryu Co., Ltd. (Headquarters: Yonezawa City, Yamagata Prefecture; Representative Director: Kenji Maeyama) is pleased to announce that its "Paper-based TPS Cleaning Sheet," developed through industry-academia-government collaborative research and corporate alliances, has been officially adopted by a major domestic semiconductor manufacturer. The product is now being utilized on actual production lines for cleaning resin encapsulation molds in the semiconductor back-end process.

### Background of Development Semiconductors used in smartphones, automobiles, and various electronic devices are manufactured through an "encapsulation (molding) process," where resin is poured into a mold to protect the device from the external environment.

In this process, cleaning is essential to remove residual resin and impurities from the mold surface. Conventionally, metal frames or glass-epoxy substrates have been used for this purpose.

However, against the backdrop of rising metal material prices and increasing demands for manufacturing process efficiency and reduced environmental impact, there has been a growing need for new materials and methods to replace these traditional options.

### Product Overview and Features This product is a sheet for cleaning semiconductor encapsulation molds, developed based on Tohoku Butsuryu Co., Ltd.'s paper processing technology.

Despite being made of paper, it possesses the following characteristics required for semiconductor manufacturing processes. In particular, regarding dust resistance—a critical factor in precision processes—we have succeeded in **suppressing dust generation** through our proprietary technology (domestically patented).

* Rigidity: Enables stable handling within the process. * Dust Resistance: Suppresses dust generation, reducing impact on precision processes. * Heat Resistance: Can be used under encapsulation process conditions (high-temperature environments). * Adsorption: Compatible with transport in automated processes.

### Effects of Introduction The product is currently in operation on actual production lines, and the following effects have been confirmed:

* Cost reduction of approximately 20–30% compared to conventional methods. * Reduction in the number of cleaning cycles from approximately 5 times to approximately 3 times. * Reduction of process load and improvement in work efficiency. * Reduction of environmental impact through the decreased use of petroleum-derived materials.

### Development Structure The development of this product was led by Tohoku Butsuryu Co., Ltd., in collaboration with universities, local governments, and support organizations.

Furthermore, for product manufacturing, we have established a production system in cooperation with manufacturing companies both within and outside Yamagata Prefecture.

### Future Outlook We plan to expand the adoption of this product, focusing on the resin encapsulation process in semiconductor back-end manufacturing, while also considering expansion into other industrial fields that require similar characteristics.

--- ### Regarding the Press Conference On March 12, 2026, we held a press conference for media outlets at the Yamagata Industrial Technology Center, in conjunction with Yamagata Prefecture.

During the event, we explained the history of the industry-academia-government development, product features, and the efforts leading up to commercialization. The event was attended by government officials, financial institution representatives, and others.

--- ### Contact Information Tohoku Butsuryu Co., Ltd.

Our company plans and sells food packaging, gift boxes, and transport boxes for precision equipment, while also providing logistics support services such as packaging, crating, and assembly. Leveraging our proven design capabilities, which have earned us the "WorldStar Award" at the World Packaging Contest, we propose optimal packaging solutions that achieve cost reduction and minimize the risk of damage.

Address: 4782 Nakada-machi, Yonezawa City, Yamagata Prefecture, 992-0011 Representative: Kenji Maeyama, Representative Director TEL: 0238-37-2230 FAX: 0238-37-2262 Website: https://www.tohoku-butsuryu.co.jp/ Email: gyomu@tohoku-butsuryu.co.jp Contact: Sekine