TANAKA Precious Metals to Exhibit at SEMICON Southeast Asia 2026
Tanaka Kikinzoku Kogyo will exhibit at SEMICON Southeast Asia 2026 in Malaysia, showcasing advanced materials for next-generation semiconductors and circular recycling solutions to strengthen its presence in the ASEAN market.
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- 📰 Published: April 28, 2026 at 20:00
- 🔍 Collected: April 28, 2026 at 11:31
- 🤖 AI Analyzed: April 28, 2026 at 13:12 (1h 40m after Collected)
Tanaka Kikinzoku Kogyo K.K. (Headquarters: Chuo-ku, Tokyo; President & CEO: Koichiro Tanaka), which develops the industrial precious metals business of the TANAKA Precious Metals Group, will exhibit at the international exhibition "SEMICON Southeast Asia 2026" (Booth No. 1521), to be held from May 5 (Tue) to 7 (Thu), 2026, at the Malaysia International Trade & Exhibition Centre (MITEC) in Kuala Lumpur, Malaysia.
At this exhibition, the company will comprehensively introduce precious metal materials and related technologies that support front-end semiconductor manufacturing processes as well as packaging and testing processes. Representative products and technologies include bonding wires, silver (Ag) adhesives, AgSn TLP sheets, sputtering targets, probe pins, various plating technologies, and precious metal recovery and refining technologies. These products and technologies contribute to the advancement of next-generation semiconductors and power electronics while promoting the circular use of precious metals.
■ Strengthening Semiconductor Business and Circular Economy Initiatives in ASEAN
Tanaka Kikinzoku has been involved in the development and manufacture of packaging materials since the 1960s. In ASEAN, it has manufacturing bases in Tanaka Electronics Singapore (PTE.) LTD., established in 1978, and Tanaka Electronics (Malaysia) SDN. BHD., established in 1994. For approximately 50 years in Malaysia and ASEAN, the company has established customer trust through a track record of product provision and technical support.
In addition to packaging and testing applications, Tanaka Kikinzoku currently develops and supplies high-purity materials and uniquely composed alloy materials essential for state-of-the-art semiconductor manufacturing in front-end processes as well.
Furthermore, by leveraging recycling technologies cultivated over many years, the company is developing a "one-stop circular solution" that consistently provides everything from the recovery and refining of precious metals to the manufacture of products using recycled precious metals. Through collaboration with customers, the company promotes the circular use of precious metals in semiconductor manufacturing, contributing to the reduction of environmental impact, carbon offsetting, and efficiency in resource utilization. It also supports the strengthening of the global recycling system and the construction of a sustainable semiconductor ecosystem in Malaysia and the ASEAN region.
[Precious Metal Materials for Semiconductor Applications]
Bonding Wires
As metal bonding materials that electrically connect semiconductor chips and external circuits, the company provides ultra-fine wires of gold (Au), silver (Ag), copper (Cu), and palladium-coated copper (PCC), as well as thick wires and ribbons of aluminum (Al) and Cu for power device applications. These materials are manufactured with controlled surface quality and dimensional stability and are provided alongside technical knowledge regarding metal bonding.
Silver (Ag) Adhesives
Silver (Ag) adhesives are conductive die-attach materials compatible not only with silicon (Si) but also with next-generation semiconductors such as silicon carbide (SiC) and gallium nitride (GaN). The lineup includes materials that achieve both high thermal conductivity and reliability, with thermal conductivity exceeding 200 W/m・K.
AgSn TLP Sheets
A sheet-like bonding material for power semiconductors capable of handling large chip sizes up to 20 mm, enabling highly reliable bonding even over large areas. It supports high-current applications such as EVs, HVs, and industrial infrastructure, achieving bonding strength of up to 50 MPa for various substrates, and is a lead-free material.
Sputtering Targets
The company provides precious metal sputtering targets for applications such as semiconductors, electronic components, and hard disk drives. Its strengths lie in high-purity/alloying technologies, strict compliance in raw material procurement, a flexible supply system, and extensive technical support. The company is also actively engaged in R&D to meet diverse customer needs.
Probe Pin Materials
For semiconductor inspection probe pins, the company provides materials with high conductivity and excellent wear resistance, supporting fine-pitch applications and custom specifications. The wide lineup, including palladium (Pd) alloys, copper (Cu) alloys, iridium (Ir), and rhodium (Rh), meets various requirements for mechanical and electrical properties. In response to increasing needs for improved durability, the company has developed "TK-SK," a proprietary material that achieves a hardness of 640 HV, exceeding conventional Pd alloys, as well as "TK-SR," a Rh-based material that combines high strength and high conductivity, catering to front-end probe card applications.
Plating Technologies and Equipment
The company provides precious metal plating chemicals for various applications, including semiconductor components. It develops plating chemicals and equipment capable of meeting production requirements from prototyping to mass production, supporting diverse chemical processes.
At this exhibition, the company will comprehensively introduce precious metal materials and related technologies that support front-end semiconductor manufacturing processes as well as packaging and testing processes. Representative products and technologies include bonding wires, silver (Ag) adhesives, AgSn TLP sheets, sputtering targets, probe pins, various plating technologies, and precious metal recovery and refining technologies. These products and technologies contribute to the advancement of next-generation semiconductors and power electronics while promoting the circular use of precious metals.
■ Strengthening Semiconductor Business and Circular Economy Initiatives in ASEAN
Tanaka Kikinzoku has been involved in the development and manufacture of packaging materials since the 1960s. In ASEAN, it has manufacturing bases in Tanaka Electronics Singapore (PTE.) LTD., established in 1978, and Tanaka Electronics (Malaysia) SDN. BHD., established in 1994. For approximately 50 years in Malaysia and ASEAN, the company has established customer trust through a track record of product provision and technical support.
In addition to packaging and testing applications, Tanaka Kikinzoku currently develops and supplies high-purity materials and uniquely composed alloy materials essential for state-of-the-art semiconductor manufacturing in front-end processes as well.
Furthermore, by leveraging recycling technologies cultivated over many years, the company is developing a "one-stop circular solution" that consistently provides everything from the recovery and refining of precious metals to the manufacture of products using recycled precious metals. Through collaboration with customers, the company promotes the circular use of precious metals in semiconductor manufacturing, contributing to the reduction of environmental impact, carbon offsetting, and efficiency in resource utilization. It also supports the strengthening of the global recycling system and the construction of a sustainable semiconductor ecosystem in Malaysia and the ASEAN region.
[Precious Metal Materials for Semiconductor Applications]
Bonding Wires
As metal bonding materials that electrically connect semiconductor chips and external circuits, the company provides ultra-fine wires of gold (Au), silver (Ag), copper (Cu), and palladium-coated copper (PCC), as well as thick wires and ribbons of aluminum (Al) and Cu for power device applications. These materials are manufactured with controlled surface quality and dimensional stability and are provided alongside technical knowledge regarding metal bonding.
Silver (Ag) Adhesives
Silver (Ag) adhesives are conductive die-attach materials compatible not only with silicon (Si) but also with next-generation semiconductors such as silicon carbide (SiC) and gallium nitride (GaN). The lineup includes materials that achieve both high thermal conductivity and reliability, with thermal conductivity exceeding 200 W/m・K.
AgSn TLP Sheets
A sheet-like bonding material for power semiconductors capable of handling large chip sizes up to 20 mm, enabling highly reliable bonding even over large areas. It supports high-current applications such as EVs, HVs, and industrial infrastructure, achieving bonding strength of up to 50 MPa for various substrates, and is a lead-free material.
Sputtering Targets
The company provides precious metal sputtering targets for applications such as semiconductors, electronic components, and hard disk drives. Its strengths lie in high-purity/alloying technologies, strict compliance in raw material procurement, a flexible supply system, and extensive technical support. The company is also actively engaged in R&D to meet diverse customer needs.
Probe Pin Materials
For semiconductor inspection probe pins, the company provides materials with high conductivity and excellent wear resistance, supporting fine-pitch applications and custom specifications. The wide lineup, including palladium (Pd) alloys, copper (Cu) alloys, iridium (Ir), and rhodium (Rh), meets various requirements for mechanical and electrical properties. In response to increasing needs for improved durability, the company has developed "TK-SK," a proprietary material that achieves a hardness of 640 HV, exceeding conventional Pd alloys, as well as "TK-SR," a Rh-based material that combines high strength and high conductivity, catering to front-end probe card applications.
Plating Technologies and Equipment
The company provides precious metal plating chemicals for various applications, including semiconductor components. It develops plating chemicals and equipment capable of meeting production requirements from prototyping to mass production, supporting diverse chemical processes.