Taiyo Ink Mfg. to Exhibit at JPCA Show 2026 – New Material for Next-Gen High-Speed Communication Boards Wins 22nd JPCA Encouragement Award

Taiyo Ink Mfg. Co., Ltd. (Headquarters: Ranzan-machi, Hiki-gun, Saitama Prefecture; President: Masaji Minegishi; hereinafter 'Taiyo Ink Mfg.'), a subsidiary of Taiyo Holdings Co., Ltd. (Headquarters: Toshima-ku, Tokyo; President: Hitoshi Saito; Securities Code: 4626), will exhibit at the 'JPCA Show 2026' – the 55th International Electronic Circuit Industry Exhibition, an electronic equipment total solution exhibition held at Tokyo Big Sight from Wednesday, June 10 to Friday, June 12, 2026. At the booth, the company will showcase a range of innovative products centered on five themes: 'Automotive Products,' 'Power Semiconductor Products,' 'High Integration Products,' 'Display Products,' and 'Conductive Materials.' Exhibits will include high-performance solder resists for PCB substrates, high-reliability solder resists for package substrates, various interlayer insulating materials, various via fill materials, gap fill materials, thermal management materials, semiconductor encapsulation materials, photosensitive coverlays, materials for 3D molded interconnect devices (MID), and various display materials. Additionally, materials for 3D molded interconnect devices will also be exhibited at the 3D-MID Pavilion. Notably, Taiyo Ink Mfg.'s new material, 'Via Fill Ink for Next-Generation High-Speed Communication Boards *1,' has won the 22nd JPCA Encouragement Award. [About the 22nd JPCA Encouragement Award-Winning Product] Product Name: 'Via Fill Ink for Next-Generation High-Speed Communication Boards' Product Overview: A through-hole via fill ink featuring a low dielectric constant (Dk) *2, adaptability to the back-drilling method *3, and excellent printability and polishability. Development Background: In recent years, with the proliferation of advanced information processing technologies such as generative AI, the volume of communication data handled continues to increase. Against this backdrop, substrate materials used in servers and communication equipment are strongly required to have high-frequency characteristics that achieve both high-speed transmission and low dielectric properties, making appropriate design and control of via fill inks essential. Furthermore, in high multilayer boards for server applications aiming for further reduction of transmission loss, the adoption of the back-drilling method for through-holes is increasing, and demand for materials for high-speed communication boards is expected to expand further. To meet these market needs, Taiyo Ink Mfg. has developed a through-hole via fill ink that achieves both low dielectric properties suitable for high-speed transmission and adaptability to the back-drilling method in high multilayer boards. Performance comparison tests between conventional products and the developed product using boards with the back-drilling method revealed that while numerous voids (small cavities) were observed inside the through-holes of conventional products, the occurrence of voids was significantly suppressed in the developed product. This demonstrates that the developed product possesses the low dielectric properties (Dk≦3.0) necessary for high-speed transmission while also achieving more stable quality and high reliability even in high multilayer boards employing the back-drilling method. Comparison of void generation due to outgassing after curing in back-drilled boards *1 Via Fill Ink: An insulating material filled into copper-plated conductive holes (through-holes) created for interlayer electrical connections in multilayer printed circuit boards. It protects the inner walls of through-holes and enhances reliability. *2 Dielectric Constant (Dk): A crucial parameter determining the propagation speed of electrical signals. Generally, a lower dielectric constant (Dk) results in faster signal propagation and reduced transmission delay within the board. Low dielectric materials with a dielectric constant (Dk) of around 3.0 to 3.2 are used for high-frequency boards. *3 Back-Drilling Method: A technique used in high-speed multilayer boards to remove unnecessary via stubs with a drill, significantly reducing transmission loss and signal reflection. When filling the back-drilled portion with via fill ink, defects such as voids can occur due to gas generated from the base material during thermal curing, making the use of materials adapted to the back-drilling method desirable. Reference: https://www.jpcashow.com/show2026/jpca_award/index.html ■ JPCA Show 2026 Exhibition Overview Exhibition Period: Wednesday, June 10 – Friday, June 12, 2026 Venue: Tokyo Big Sight, East Exhibition Hall 1 (3D-MID Pavilion: East Exhibition Hall 7) Booth Number: 1B-50 (3D-MID Pavilion: 7C-28, 7C-29) Exhibition Details: https://www.jpcashow.com/show2026/index.html Our Exhibition Content: https://jpca2026.tems-system.com/eguide/jp/jpca/details/Dt2HiisylS0 Taiyo Holdings is a leading company boasting the world's No.1 market share *4 in solder resists (insulating materials that protect the surface of printed circuit boards used in various electronic devices). Leveraging the power of chemistry, the group promotes diverse business activities, including the Electronics Business (development, manufacturing, and sales of chemical materials for electronic components crucial for numerous electronics products), the Medical & Pharmaceutical Business (manufacturing, sales, and contract manufacturing of pharmaceutical products), the ICT Business (supporting the group and customers digitally), the Fine Chemicals Business (contract synthesis and development), the Energy Business (promoting renewable energy), and the Food Business (operating plant factories). Taiyo Ink Mfg. is responsible for the development, manufacturing, sales, and procurement/sale of chemicals for electronic equipment, including printed circuit board materials such as solder resists, within the Electronics Business. Leveraging the technology cultivated through solder resists, the company focuses on the continuous growth of existing businesses and the creation of new business domains, contributing to technological innovation in the electronics field. *4 Source: '2024 Current Status and Future Outlook of Advanced Electronic Materials,' Fuji Chimera Research Institute, Inc. Taiyo Ink Mfg. Co., Ltd. Company Profile [Headquarters] 900 Hirosawa, Ranzan-machi, Hiki-gun, Saitama Prefecture 355-0215, Japan [Representative] Masaji Minegishi [Established] August 5, 1999 [Capital] 450 million yen URL: https://www.taiyo-hd.co.jp/jp/group/ink/ Taiyo Holdings Co., Ltd. Company Profile [Registered Head Office] 388 Okura, Ranzan-machi, Hiki-gun, Saitama Prefecture 355-0222, Japan [Head Office] Metropolitan Plaza Building 16F, 1-11-1 Nishi-Ikebukuro, Toshima-ku, Tokyo 171-0021, Japan [Representative] Hitoshi Saito [Established] September 29, 1953 [Capital] 10,206,170,000 yen [Employees] Consolidated 2,561 / Non-consolidated 176 (as of end of March 2026) URL: https://www.taiyo-hd.co.jp