Sumitomo Bakelite Announces Start of Sampling for Liquid Encapsulant for Advanced Packages

Sumitomo Bakelite Co., Ltd. (Headquarters: Shinagawa-ku, Tokyo; President: Shinichi Kajiya) announces that it has developed and begun sampling the EME-L series, a low-warpage, high-reliability liquid encapsulant, to address the increasing size and complexity of semiconductor packages accompanying the advancement of AI technology. Background of Development: With the rapid spread of generative AI, semiconductor packages are required to have additional functions, improved processing speeds, and increased processing capacity. As a result, the adoption of 2.xD/3D structures and chiplet structures is progressing, leading to larger package sizes. Under these circumstances, to achieve larger packages while maintaining economic productivity, further improvements in low warpage and processing performance are required for liquid encapsulants. In response to strong customer demand, we have undertaken the development of a liquid encapsulant that meets these needs. Features of the EME-L Series: The EME-L series of liquid encapsulants developed by our company achieves both low warpage performance and the necessary processing performance by applying formulation and prescription technologies cultivated over many years with solid encapsulants, as well as process technology for liquid products for electronic materials. This low-warpage performance facilitates handling in post-encapsulation processes. The EME-L series also includes products capable of mold underfill, which can reduce and streamline the manufacturing process by integrating the undermold and overmold (full encapsulation) steps (see diagram below). These features contribute to achieving higher functionality and larger sizes for next-generation packages. Future Plans: We will begin sampling in April 2026, aiming for certified adoption in 2027. We will continue to promote customer-oriented material development while maintaining close relationships with our customers. In the future, we will contribute to the development of AI technology by providing functional products not yet seen in the world, combining our world-leading solid encapsulants with liquid encapsulants. For inquiries regarding this matter: Sumitomo Bakelite Co., Ltd. Information & Telecommunication Materials Sales Division lmc@ml.sumibe.co.jp