Regarding the Start of Mass Production of High-Speed Seal Compatible Cover Tape 'Sumilite® CSL-Z7304'

Sumitomo Bakelite Co., Ltd. (Headquarters: Shinagawa-ku, Tokyo, President and CEO: Shinichi Kajiyashi) has commenced mass production of 'Sumilite® CSL-Z7304', a high-speed seal compatible cover tape that provides sufficient peel strength even with short sealing times*1. It is designed for ultra-small electronic components that require reliable sealing in a short time, and features high reliability, being difficult to tear even with a 4mm width carrier tape (cover tape width: 2.6mm).

*1 Sealing time: Indicates the time until the cover tape and carrier tape adhere.

　Development Background

In recent years, with the spread and increased performance of smart devices, electronic components are becoming smaller and more numerous, driving demand for further production efficiency. Consequently, cover tapes for transporting electronic components require thinner widths to accommodate ultra-small parts and high-speed sealing capabilities to enable faster component loading onto carrier tapes.

　Features of Sumilite® CSL-Z7304

This product optimizes the sealant layer design, providing sufficient peel strength even with short bonding times, thus contributing to faster customer processes and improved productivity.
Furthermore, by adopting a tough material, it meets the JIS standard (C0806-3) requirement of a breaking strength of 10N≦ for 4mm width carrier specifications (cover tape width: 2.6mm), making it resistant to tearing. Additionally, it boasts excellent transparency, making packaged electronic components and semiconductors easy to see and minimizing obstruction of camera inspections.

Our company offers a wide range of products to solve packaging challenges arising from the ongoing miniaturization of components and to address customer concerns. If you have any packaging-related issues, please do not hesitate to contact us.