Horiba Advanced Techno Joins Next-Gen Semiconductor Packaging Consortium "JOINT3"

In May 2026, Horiba Advanced Techno joined the co-creation platform "JOINT3," led by Resonac. This expansion brings the total number of member companies to 28, accelerating the R&D of panel-level organic interposers. Leveraging Horiba's advanced water and liquid measurement technology, the partnership aims to drive innovation in next-generation semiconductor packaging.
提携NQ 88/100出典:PR Times

📋 Article Processing Timeline

  • 📰 Published: May 26, 2026 at 20:00
  • 🔍 Collected: May 26, 2026 at 11:31
  • 🤖 AI Analyzed: May 26, 2026 at 12:03 (31 min after Collected)
In May 2026, Horiba Advanced Techno (President: Kentaro Nishikata) joined the co-creation evaluation platform "JOINT3," led by Resonac Corporation (President & CEO: Hidehito Takahashi). This addition brings the number of participating companies in JOINT3 to 28. By incorporating Horiba's advanced technical expertise, the consortium will further accelerate the R&D of panel-level organic interposers.

Horiba Advanced Techno has contributed to the advancement of manufacturing processes with its strength in water and liquid measurement technologies, which are indispensable in the semiconductor industry. As semiconductor performance continues to scale, innovation in next-generation semiconductor packaging technology and the addressing of complex technical challenges have become critical. Leveraging the core technologies of the HORIBA Group in analysis, measurement, and control, Horiba Advanced Techno will contribute to the R&D and problem-solving efforts within JOINT3.

Through JOINT3, Resonac remains committed to advancing technical R&D for next-generation semiconductor packaging, including panel-level organic interposers, to foster semiconductor evolution and industrial progress.

[About JOINT3]
JOINT3 is a co-creation effort where global semiconductor material, equipment, and design tool manufacturers collaborate to develop technologies suitable for panel-level organic interposers using a dedicated prototype line. Resonac's upcoming activity center, "APLIC" (Advanced Panel Level Interposer Center), will enable verification in an environment closely resembling actual structures, thereby accelerating the technological development of participating companies.

[About HORIBA Group and Horiba Advanced Techno]
The HORIBA Group is a leading company in analysis and measurement systems, with 47 group companies across 29 countries and regions globally. It provides advanced solutions across three core fields: "Energy & Environment," "Bio & Healthcare," and "Advanced Materials & Semiconductors." Within semiconductor manufacturing, it plays a critical role in processes such as gas flow control and chemical concentration management. Horiba Advanced Techno, responsible for the water and liquid measurement business, supports the circularity of water resources and contributes to a wide range of fields, from cutting-edge semiconductor manufacturing processes to drug discovery research, through its precision chemical measurement technology.

FAQ

JOINT3とはどのような組織ですか?

グローバルの半導体材料・装置・設計ツールメーカーが共創し、パネルレベル有機インターポーザーの試作ラインを用いて技術開発を推進するプラットフォームです。

株式会社堀場アドバンスドテクノがJOINT3に参画した目的は何ですか?

HORIBAグループが有する分析・計測・制御技術を生かし、パネルレベル有機インターポーザーの研究開発および技術課題の解決に貢献するためです。

JOINT3の活動拠点APLICでは何ができますか?

実際の構造に近い環境で検証を行うことが可能となり、参画企業による次世代半導体パッケージの技術開発を加速させます。

堀場アドバンスドテクノはどのような技術に強みを持っていますか?

半導体産業において不可欠な水・液体計測技術を強みとしており、半導体製造プロセスの高度化や薬液濃度管理などに貢献しています。

今回の参画によりJOINT3の参画企業数はどうなりましたか?

堀場アドバンスドテクノの参画により、計28社となりました。