Launch of HEATEX® TS500 Series High Thermal Conductivity Sheets

Bando Chemical Industries, Ltd. (Headquarters: Kobe, Hyogo) announced the launch of its HEATEX® TS500 series high thermal conductivity sheets starting May 2026. 1. Background and Objectives In sectors such as automotive equipment for EVs, communication devices, and AI data centers, there is a rapidly growing demand for materials capable of reliable heat dissipation under low load, driven by the increasing performance and mounting density of electronic components. The TS500 series is an insulating-type thermal sheet developed specifically to meet these needs. 2. Key Features of the New Product (1) Balancing Industry-Leading Thermal Conductivity with Ease of Implementation The TS500 series is an extremely flexible sheet with a thermal conductivity more than 1.5 times higher than the company's previous products. It adheres closely to heat-generating components and cooling units, maximizing the material's inherent thermal performance. (2) Vertical Thermal Conductivity Structure via Proprietary Technology The superior thermal conductivity is achieved by vertically aligning thermal fillers (Boron Nitride: electrically insulating) using proprietary alignment technology. (3) Enhanced Freedom in Thermal Design The TS500 series stably delivers its expected thermal performance at approximately 20% compression. This facilitates thermal design in precision equipment and layered structures where high compression is undesirable. High Thermal Conductivity Sheet: HEATEX TS500 Series