Nuvoton Japan Expands Lineup of Light Sources for Maskless Exposure in Advanced Semiconductor Packaging
Nuvoton Technology has begun mass production of a high-power 4.5W purple (402nm) semiconductor laser in a TO-9 CAN package, achieving industry-leading optical output. This product enhances the throughput of maskless exposure equipment for advanced semiconductor packaging.
📋 Article Processing Timeline
- 📰 Published: April 15, 2026 at 22:00
- 🔍 Collected: April 15, 2026 at 13:31
- 🤖 AI Analyzed: April 19, 2026 at 11:54 (94h 22m after Collected)
Nuvoton Technology (hereinafter referred to as "the Company") will begin mass production of its "High-Power 4.5W Purple (402nm) Semiconductor Laser [2]," which has achieved the industry's highest class (*1) optical output in a 9.0mm diameter CAN package (TO-9) [1]. Through the Company's proprietary device structure and heat dissipation design technology, this product achieves 1.5 times the optical output of conventional products (*2), contributing to improved production throughput in optical equipment such as maskless exposure systems [3]. Furthermore, with the addition of this product to the lineup, the Company's product portfolio can now support multiple major photosensitive materials [5] used in advanced semiconductor packaging [4].
(*1) As of April 15, 2026, according to the Company's research. For TO-9 CAN package semiconductor lasers under continuous wave (CW) conditions at a wavelength of 402nm and a case temperature (Tc) of 25°C.
(*2) The Company's conventional product KLC432FL01WW (402nm, 3.0W, TO-9 CAN package).
[Effects of this product]
1. Achieves a high output of 4.5W, 1.5 times that of the Company's conventional products in the purple (402nm) band, contributing to improved production throughput for optical equipment like maskless exposure systems.
2. Expands the lineup of maskless exposure light sources for advanced semiconductor packaging, supporting multiple major photosensitive materials.
3. Expands the lineup of mercury lamp alternative solutions [6], providing new options for selecting light sources.
Click here for product details
[Features of the Company's New Product]
1. Achieves a high output of 4.5W in the purple (402nm) band, 1.5 times that of conventional products, contributing to improved throughput for optical equipment like maskless exposure systems.
Purple (402nm) semiconductor lasers have had difficulty maintaining stable operation in high-output regions because of their relatively low optical power conversion efficiency [7] and large self-heating, in addition to their susceptibility to element degradation caused by short-wavelength light. Therefore, the Company has applied the "device structure that increases optical power conversion efficiency" and the "high heat dissipation package technology that efficiently releases heat"—which were introduced in the "High-Power 1.0W Ultraviolet (379nm) Semiconductor Laser [8]" announced in January 2026—to the purple (402nm) band as well. In particular, by applying a proprietary protective film technology that suppresses degradation factors on the laser facet, lifetime performance during high-power operation is improved. Furthermore, heat dissipation is enhanced by adopting a unified molded structure using high heat dissipation materials for the package. As a result, the Company has succeeded in developing the "High-Power 4.5W Purple (402nm) Semiconductor Laser," achieving both "high power" (1.5 times the optical output of conventional products) and "high reliability." This product contributes to improving production throughput in industrial optical equipment where high quality is demanded.
Figure 1: "Device structure that increases optical power conversion efficiency" and "High heat dissipation package technology that efficiently releases heat"
2. Expands the lineup of maskless exposure light sources for advanced semiconductor packaging, supporting multiple major photosensitive materials.
This product delivers significant value in maskless exposure technology within the advanced semiconductor packaging sector, a market growing rapidly against the backdrop of expanding demand for AI (Artificial Intelligence) and other applications. In the circuit formation of advanced semiconductor packaging, maskless exposure technology—which directly draws circuits based on design data—has gained attention in recent years because it allows for highly precise drawing corrections according to substrate warpage and distortion, in addition to reducing costs and shortening development time. Semiconductor lasers, one of the primary light sources in this maskless exposure technology, have been required to support wavelengths close to the emission lines of mercury lamps, specifically the i-line (365nm) and h-line (405nm), to correspond with major photosensitive materials, as well as to achieve higher output aimed at improving equipment production throughput. At this time, in addition to the i-line compatible "High-Power 1.0W Ultraviolet (379nm) Semiconductor Laser" announced in January 2026, the Company is adding this product to its maskless exposure light source lineup for advanced semiconductor packaging as an h-line compatible solution. This allows the Company to consistently provide light sources that support multiple major photosensitive materials and contribute to improving equipment production throughput.
Table 1: Main photosensitive materials in maskless exposure for advanced semiconductor packaging and the Company's proposed products
3. Expands the lineup of mercury lamp alternative solutions, providing new options for selecting light sources.
This product is a new addition to the Company's lineup of "Mercury Lamp Alternative Solutions using Semiconductor Lasers." The h-line (405nm), an emission line of mercury lamps, is widely used for photocuring...
(*1) As of April 15, 2026, according to the Company's research. For TO-9 CAN package semiconductor lasers under continuous wave (CW) conditions at a wavelength of 402nm and a case temperature (Tc) of 25°C.
(*2) The Company's conventional product KLC432FL01WW (402nm, 3.0W, TO-9 CAN package).
[Effects of this product]
1. Achieves a high output of 4.5W, 1.5 times that of the Company's conventional products in the purple (402nm) band, contributing to improved production throughput for optical equipment like maskless exposure systems.
2. Expands the lineup of maskless exposure light sources for advanced semiconductor packaging, supporting multiple major photosensitive materials.
3. Expands the lineup of mercury lamp alternative solutions [6], providing new options for selecting light sources.
Click here for product details
[Features of the Company's New Product]
1. Achieves a high output of 4.5W in the purple (402nm) band, 1.5 times that of conventional products, contributing to improved throughput for optical equipment like maskless exposure systems.
Purple (402nm) semiconductor lasers have had difficulty maintaining stable operation in high-output regions because of their relatively low optical power conversion efficiency [7] and large self-heating, in addition to their susceptibility to element degradation caused by short-wavelength light. Therefore, the Company has applied the "device structure that increases optical power conversion efficiency" and the "high heat dissipation package technology that efficiently releases heat"—which were introduced in the "High-Power 1.0W Ultraviolet (379nm) Semiconductor Laser [8]" announced in January 2026—to the purple (402nm) band as well. In particular, by applying a proprietary protective film technology that suppresses degradation factors on the laser facet, lifetime performance during high-power operation is improved. Furthermore, heat dissipation is enhanced by adopting a unified molded structure using high heat dissipation materials for the package. As a result, the Company has succeeded in developing the "High-Power 4.5W Purple (402nm) Semiconductor Laser," achieving both "high power" (1.5 times the optical output of conventional products) and "high reliability." This product contributes to improving production throughput in industrial optical equipment where high quality is demanded.
Figure 1: "Device structure that increases optical power conversion efficiency" and "High heat dissipation package technology that efficiently releases heat"
2. Expands the lineup of maskless exposure light sources for advanced semiconductor packaging, supporting multiple major photosensitive materials.
This product delivers significant value in maskless exposure technology within the advanced semiconductor packaging sector, a market growing rapidly against the backdrop of expanding demand for AI (Artificial Intelligence) and other applications. In the circuit formation of advanced semiconductor packaging, maskless exposure technology—which directly draws circuits based on design data—has gained attention in recent years because it allows for highly precise drawing corrections according to substrate warpage and distortion, in addition to reducing costs and shortening development time. Semiconductor lasers, one of the primary light sources in this maskless exposure technology, have been required to support wavelengths close to the emission lines of mercury lamps, specifically the i-line (365nm) and h-line (405nm), to correspond with major photosensitive materials, as well as to achieve higher output aimed at improving equipment production throughput. At this time, in addition to the i-line compatible "High-Power 1.0W Ultraviolet (379nm) Semiconductor Laser" announced in January 2026, the Company is adding this product to its maskless exposure light source lineup for advanced semiconductor packaging as an h-line compatible solution. This allows the Company to consistently provide light sources that support multiple major photosensitive materials and contribute to improving equipment production throughput.
Table 1: Main photosensitive materials in maskless exposure for advanced semiconductor packaging and the Company's proposed products
3. Expands the lineup of mercury lamp alternative solutions, providing new options for selecting light sources.
This product is a new addition to the Company's lineup of "Mercury Lamp Alternative Solutions using Semiconductor Lasers." The h-line (405nm), an emission line of mercury lamps, is widely used for photocuring...