Nikkiso Wins '32nd Semiconductor of the Year 2026' for the First Time

Nikkiso Co., Ltd. (hereinafter 'Nikkiso') announced that its 'High-Productivity Pressure Sintering System 3D Sinter for SiC Power Semiconductors' received the 'Excellence Award' in the Semiconductor Manufacturing Equipment category at the 'Semiconductor of the Year 2026.' The award ceremony was held on Wednesday, June 10, 2026, at Tokyo Big Sight, where the organizer, Sangyo Times, presented the award and winning companies gave presentations. This is Nikkiso's first time receiving this award.

'Semiconductor of the Year' is selected by votes from reporters of the Electronic Device Industry News published by Sangyo Times, based on criteria such as development novelty, mass production setup, social impact, and future potential.

■ About the winning product '3D Sinter'

This is a device that joins (sinters) SiC chips and substrates using heat and pressure in the bonding process of SiC power semiconductors onto substrates. Its feature lies in the three-dimensional press using a special gel-like pressure medium based on Nikkiso's proprietary '3D press method,' which allows for uniform, simultaneous bonding of chips and substrates with different heights. Compared to traditional metal press methods that apply pressure on a flat plane, this enables the production of more efficient and high-quality modules.

Detailed information and videos about the features of the 3D Sinter are available on the Nikkiso website.

https://www.nikkiso.co.jp/products/industrial/sintering/3d.html

■ Future Outlook

With the recent rapid expansion of AI and EV usage, demand for SiC power semiconductors, which have superior pressure resistance and the ability to stably flow large currents compared to conventional semiconductors, is increasing. Nikkiso will continue to strive to develop manufacturing equipment that meets customer needs to further improve the productivity and quality of SiC power semiconductors.

■ About 'Semiconductor of the Year'

The 32nd 'Semiconductor of the Year' is selected in three categories: Semiconductor Devices, Semiconductor Manufacturing Equipment, and Electronic Materials for Semiconductors. This year, candidate products and technologies were selected from new products (including version upgrades) announced between April 2025 and March 2026 and introduced in the Electronic Device Industry News, including recommendations from the newspaper's reporters and open applications, and winners were chosen through strict reporter voting.