Practical Seminar on Thermal Management for Electronic Devices: Bridging Circuit and Mechanical Design
The IR Technical Education Institute will host a thermal management seminar on July 13, 2026, featuring expert instructors from Kamigami Corp, focusing on integrated circuit and mechanical heat mitigation.
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- 📰 Published: May 26, 2026 at 20:00
- 🔍 Collected: May 26, 2026 at 11:31
- 🤖 AI Analyzed: May 26, 2026 at 11:42 (10 min after Collected)
The IR Technical Education Institute is hosting a public seminar that provides practical, essential countermeasures for thermal management from both board/circuit design and mechanical/structural design perspectives. As electronic devices become increasingly dense and compact, balancing performance and reliability while managing heat dissipation is a critical challenge. This seminar focuses on fundamentally organizing design principles and learning reproducible thermal management strategies.
Seminar Overview
Seminar Title: Thermal Management Clinic for Electronic Devices: A Dual Approach through Circuit and Mechanical Design
Format: In-person / Live streaming / Archived stream
Location: In-person at Japan IR HQ / Online via Zoom
Date & Time: Monday, July 13, 2026, 10:00–16:00 (Archive available July 15–July 29)
Tuition: 49,500 JPY (tax included) per person
Instructors: Takashi Suzuki, Takashi Tago (Kamigami Corporation)
Key Program Highlights:
1. Three Laws of Heat and Current Trends
2. Thermal Design in Circuits and Boards
3. Circuit Malfunction Case Studies
4. Measurement Techniques for Real Devices
5. Structural Thermal Design (TIM selection, etc.)
6. Thermal Structural Design Failure Analysis
7. Thermal Simulation (CAE)
Seminar Overview
Seminar Title: Thermal Management Clinic for Electronic Devices: A Dual Approach through Circuit and Mechanical Design
Format: In-person / Live streaming / Archived stream
Location: In-person at Japan IR HQ / Online via Zoom
Date & Time: Monday, July 13, 2026, 10:00–16:00 (Archive available July 15–July 29)
Tuition: 49,500 JPY (tax included) per person
Instructors: Takashi Suzuki, Takashi Tago (Kamigami Corporation)
Key Program Highlights:
1. Three Laws of Heat and Current Trends
2. Thermal Design in Circuits and Boards
3. Circuit Malfunction Case Studies
4. Measurement Techniques for Real Devices
5. Structural Thermal Design (TIM selection, etc.)
6. Thermal Structural Design Failure Analysis
7. Thermal Simulation (CAE)
FAQ
セミナーの対象者は誰ですか？
ハードウェア開発の若手設計者や、電子機器の熱対策を構築したいプロジェクトマネージャーを想定しています。
セミナーではどのような内容を学びますか？
熱の三原則から、回路・基板レベルでの発熱削減、構造設計におけるTIM（熱伝導材料）の選定、熱シミュレーション（CAE）まで、実践的な熱設計手法を体系的に学びます。
開催日時と受講形式を教えてください。
会場受講とLive配信は2026年7月13日10:00〜16:00です。アーカイブ配信は2026年7月15日から7月29日まで視聴可能です。
講師は誰ですか？
神上コーポレーション株式会社の代表取締役CEO 鈴木崇司氏と、回路技術顧問 多胡隆司氏が担当します。
受講料はいくらですか？
1名につき49,500円（税込）です。複数名受講割引もあります。