According to a recent report by South Korean media outlet The Bell, SK Hynix has officially launched mass production and shipment of its 12-layer stacked HBM4 memory, designed for NVIDIA’s next-generation AI platform 'Vera Rubin.' The product is currently in the production ramp-up phase, with large-scale manufacturing scheduled to begin in September this year.

The report highlights that the entire process—from wafer input to final shipment—was completed in just over two months, significantly shorter than the industry-standard four-month cycle. This accelerated timeline was made possible by close collaboration between the two companies: SK Hynix activated an emergency production mode, assigning the highest priority to manufacturing processes, while NVIDIA streamlined its quality verification procedures to meet urgent supply demands.

Market estimates suggest that SK Hynix is expected to capture approximately 60% of NVIDIA’s total HBM4 supply volume, with some analysts projecting the share could rise to 70%, further solidifying its position as the primary preferred supplier.

Technologically, SK Hynix’s HBM4 uses fifth-generation 10-nanometer-class (1b) DRAM for the core chip and a 12-nanometer process from TSMC for the base die, effectively balancing performance and cost control. This gives SK Hynix a significant cost advantage over Samsung Electronics.

As shipments increase in the second half of 2026, HBM4 is projected to surpass HBM3E in terms of overall HBM sales contribution by the fourth quarter of 2026, becoming the main revenue driver for SK Hynix.

In addition to securing stable orders from NVIDIA, SK Hynix is actively expanding its multi-client strategy. Following the completion of mass production for NVIDIA’s 12-layer HBM4 last month, the company has begun shipping 8-layer stacked HBM4 to AMD this month.

Through ultra-fast production, optimized certification, and successful multi-client deployment, SK Hynix is comprehensively leading the global commercialization of HBM4.

FACT BOX

  • Source: PR Times
  • Category: New Product
  • Products / services: HBM4 / DRAM