Maruem Shokai to Exhibit at 'Kansai Nepcon Japan': Introducing Japan's First 12-inch SiC Epi-Wafer

Maruem Shokai Co., Ltd. (HQ: Nagoya; President: Takao Nishioka), a technology-oriented trading company, will participate in the '2nd Kansai Nepcon Japan' (Venue: Intex Osaka; Booth: K36-6) from May 13th (Wed) to 15th (Fri), 2026. The company will propose optimal combinations of SiC-related products and technologies from domestic and international partners, covering the entire spectrum from wafers and epitaxial (Epi) processes to materials, chips, and peripheral equipment. A major highlight will be the first public showing in Japan of a 12-inch SiC wafer with an epitaxial layer.

As the demand for SiC power semiconductors grows, the importance of material supply continues to rise. Maruem Shokai contributes to the development of next-generation power electronics by providing tailored proposals based on the products and technologies of its global partners.

### Main Products and Manufacturers (Planned)

#### SiC Wafers
* **12-inch N-type and Optical SiC Wafers, 8/12-inch Sapphire Wafers (JSG/Super SiC)**
JSG (Zhejiang Jingsheng Mechanical & Electrical Co., Ltd., Shaoxing) was founded in 2006 as a venture from Zhejiang University. Recognized as a Chinese innovative company by Forbes (2021/2022), it has ranked as a top-10 high-growth enterprise for six consecutive years. With 2024 sales of approximately 370 billion yen and over 6,000 employees, the company maintains a 20% R&D ratio. Its core business includes crystal materials (Si, Sapphire, SiC) and manufacturing equipment, holding an 80% share of China's solar polysilicon equipment market and a 50% global share in sapphire wafers.

* **12-inch SiC Wafer with Epitaxial Layer (TYSiC - Japan First Reveal)**
TYSiC (Dongguan, China), founded in 2009, is a dedicated SiC epitaxial processing company. It was the first in China to achieve mass production for 4/6-inch wafers and holds the top market share in China (Source: Frost & Sullivan). Production capacity is expected to reach 1.1 million units by 2026 and 1.5 million by 2027, supplying the EV, data center, telecommunications, and railway industries.

* **8-inch SiC Wafer (JCC)**
Jing Cheng (JCC) is a Taiwan-based manufacturer of SiC single-crystal materials, focusing on ingots and wafers. While 6/8-inch wafers are their main products, 12-inch versions are in the R&D stage. They provide both N-type and semi-insulating wafers with high crystal quality and low defect density.

#### Chips, Components, and Materials
* **Pin-fin Baseplates (IRON FORCE)**
Iron Force (Taiwan) will showcase cooling components for power semiconductors. As an automotive part manufacturer, they provide cooling solutions primarily for on-vehicle IGBT modules. The exhibit will highlight high-performance cooling modules based on thermal simulation and reliability design proven in the automotive field.

* **CMP Process Consumables: Retainer Rings, Wafer Rollers, High-density Brushes (AKT Components)**
AKT Components (Malaysia) is a precision manufacturer of consumables for the semiconductor CMP process. They supply global semiconductor manufacturers with high-precision plastic molded and metal-processed parts.

* **Power Device Chip Solutions (UNT)**
UNT (Zhejiang, China), founded in 2018, has maintained a 99% annual growth rate. They are a top-tier provider of power semiconductor chips such as IGBTs and MOSFETs in China, offering OEM and ODM services with a focus on automotive and industrial quality.

* **High-sensitivity Si-Graphene Barristor FET Sensor (MCK Tech Co.,Ltd)**
This sensor utilizes the junction between graphene and silicon to achieve high sensitivity.