Marubun to Exhibit at 'Total Solution Exhibition for Electronic Equipment 2026' Starting June 10

Key facts

  • Marubun to Exhibit at 'Total Solution Exhibition for Electronic Equipment 2026' Starting June 10
  • Marubun Corporation will exhibit at the 'Total Solution Exhibition for Electronic Equipment 2026' at Tokyo Big Sight from June 10, showcasing cutting-edge flip-chip bonding equipment.
  • Source: PR Times
  • Date: May 27, 2026

Direct answer

Marubun Corporation will exhibit at the 'Total Solution Exhibition for Electronic Equipment 2026' at Tokyo Big Sight from June 10, showcasing cutting-edge flip-chip bonding equipment.

Citation
Marubun to Exhibit at 'Total Solution Exhibition for Electronic Equipment 2026' Starting June 10 (May 27, 2026), PR Times
Source
PR Times
Date
May 27, 2026
Marubun Corporation will exhibit at the 'Total Solution Exhibition for Electronic Equipment 2026' at Tokyo Big Sight from June 10, showcasing cutting-edge flip-chip bonding equipment.
techNQ 48/100出典:PR Times

📋 Article Processing Timeline

  • 📰 Published: May 27, 2026 at 10:30
  • 🔍 Collected: May 31, 2026 at 22:47 (108h 17m after Published)
  • 🤖 AI Analyzed: May 31, 2026 at 22:50 (2 min after Collected)
Electronics trading company Marubun Corporation will participate in the 'Total Solution Exhibition for Electronic Equipment 2026,' held at Tokyo Big Sight from June 10 (Wed) to June 12 (Fri). The company will showcase next-generation packaging development equipment, including the 'FC300' for ultra-high-precision assembly required in fields such as micro-LEDs, quantum computers, and silicon photonics, as well as the 'NEO-HB' for mass production.

FAQ

Is this technology important for Taiwanese companies?

Yes, as Taiwan leads the global semiconductor and packaging industry, high-precision assembly technology is critical.

What are the key facts in this article?

Marubun Corporation will exhibit at the 'Total Solution Exhibition for Electronic Equipment 2026' at Tokyo Big Sight from June 10, showcasing cutting-edge flip-chip bonding equipment.

What is the direct answer?

Marubun Corporation will exhibit at the 'Total Solution Exhibition for Electronic Equipment 2026' at Tokyo Big Sight from June 10, showcasing cutting-edge flip-chip bonding equipment.