Nihon Zairyo Giken Launches Difunctional Linked Benzoxazine 'BBzP'

Nihon Zairyo Giken Co., Ltd. (Headquarters: Chuo-ku, Tokyo; President and Representative Director: Kosuke Urata; hereafter 'the Company') has launched 'BBzP,' a new difunctional linked benzoxazine characterized by high heat resistance, low moisture absorption, and low dielectric properties.

This product is a curable monomer with a structure where two benzoxazine rings are directly linked, possessing the signature traits of benzoxazine resins such as high heat resistance, low moisture absorption, low dielectric properties, and low curing shrinkage. Generally, benzoxazine monomers tend to exhibit high melting points while demonstrating high heat resistance; however, this product realizes a low melting point by forming a high cross-linking density network as a difunctional monomer with a molecular structure in which benzoxazine rings are directly linked. The cured product has a glass transition temperature (Tg) of approximately 250°C, providing excellent heat resistance, while its low melting point of about 117°C makes it easy to formulate into resin compositions, contributing to greater flexibility in material design through hybridization with existing resins such as epoxy resins.

In recent years, due to the higher performance and high-density mounting of electronic components, electronic materials such as sealing materials, substrate materials, and adhesives are required to have improved reliability, including low moisture absorption and low dielectric constants in addition to high heat resistance. This product, as a high-heat-resistant curable resin that meets these demands, is expected to find applications in a wide range of fields, including electronics, aerospace materials, and heat-resistant adhesives.

The Company has been working on the industrialization of high-heat-resistant curable resins and is expanding its lineup, which includes BTBz (another benzoxazine), polycyclic alicyclic epoxies, and mesogenic epoxies. Nihon Zairyo Giken remains committed to the development and commercialization of innovative electronic materials.